Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects
Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects
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DOI：
10.1109/irps48203.2023.10117720
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发表时间：
2023-03
期刊：
影响因子：
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通讯作者：
J. Mendoza;Jimmy-Bao Le;C. Kim;H. Lin
中科院分区：
文献类型：
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作者：
J. Mendoza;Jimmy-Bao Le;C. Kim;H. Lin
本文报道了一种新的方法来检测在完全封装的器件中的封装互连中的损坏和故障，该方法对互连中的损坏具有足够的灵敏度和选择性。通过对各种电测方法的研究，得出结论：一些电测技术，特别是低频交流信号的电测技术，可以提供有效的损伤检测机制。阻抗和导出的参数，如电容和电感显示硅封装相互作用的损害的敏感性，具有令人满意的免疫力，寄生信号存在于完全组装/封装的测试芯片，如探针/焊盘接触电阻和杂散电容从各种来源。文中介绍了基于“开路测试图”的两个典型算例，以验证所提出方法的有效性。第一个是在高电阻开路图案中的损伤检测，该图案由策略性地放置在Si芯片的BEOL中的故障易发位置上的小金属蛇形物组成。在金属蛇形线中产生的小损伤使得电路产生LC谐振样信号，这在检测损伤的存在及其位置中是有用的。第二种是对低电阻开路图案（如焊料互连）中的损伤/失效敏感的阻抗方法。该方法测量作为频率的函数的阻抗，并且设计成主要使用AC电阻中的集肤效应来检测在焊点处捕获/发展的裂纹和/或空隙。该技术有其自身的局限性，但可以有效地表征封装互连中的损伤。
This paper reports new methods of detecting damages and failures in packaging interconnects in fully packaged devices with sufficient sensitivity and selectivity for damages in interconnects. Exploration on various electrical methods leads to the conclusion that a few electrical measurement techniques, especially one using a low frequency AC signal, may provide effective mechanism of detecting the damages under interest. Impedance and derived parameters such as capacitance and inductance show sensitivity to silicon-package-interaction damages, with satisfactory immunity to parasitic signals present in fully assembled/packaged test chips such as the probe/pad contact resistance and stray capacitance from various sources. Two highlighting examples based on the “open circuit test pattern” are introduced in this paper to demonstrate the effectiveness of developed methods. The first is the damage detection in the high resistance open circuit pattern, which consists of small metal serpentines strategically placed on the failure prone places in BEOL of Si chip. Small damage develop in the metal serpentine makes the circuits to produce LC resonance-like signals useful in detecting presence of damage and its location. The second is the impedance method sensitive to the damage/failure in low resistance open circuit pattern like solder interconnects. The method measures the impedance as a function of frequency and design to detects the crack and/or void trapped/developed at the solder joints mainly using the skin effect in AC resistance. The technique is with its own limitations but can enable effective characterization of damages in package interconnects.