Performance of Cr mask for extreme-ultraviolet lithography
Performance of Cr mask for extreme-ultraviolet lithography
复制标题
极紫外光刻用Cr掩模的性能
DOI:
10.1117/12.438367
复制
发表时间:
2001
期刊:
影响因子:
--
通讯作者:
Y. Sugie
中科院分区:
文献类型:
--
作者:
H. Nii;H. Kinoshita;Takeo Watanabe;K. Hamamoto;H. Tsubakino;Y. Sugie
Recently, extreme ultraviolet lithography (EUVL) becomes to be a candidate for the next generation lithography (EUVL) becomes to be a candidate for the next generation lithographic technology form 70 nm down to 35 nm. In this technology, multilayer films coating on the thick glass substrate is used. We have proposed the Cr absorber mask for EUVL using wet process. Cr absorber has been generally used as photomask, and been also supposed to be a promising material as absorber for EUVL mask because of its both high extreme ultraviolet (EUV) contrast and excellent chemical durability. The mask absorber pattern typically including the patterns of 0.35micrometers width lines and spaces (L&S) has been completely fabricated without degradation of the multilayer. Furthermore, the fine patterns width of less than 0.15micrometers have been successfully fabricated in the entire mask area of the 4-inch-diameter wafer. The EUVL mask has been evaluated with the EUVL laboratory tools at the beamline BL3 at the NewSUBARU synchrotron radiation facility. Line and spaces pattern width of less than 0.1micrometers are clearly replicated and isolated lines pattern width of 40nm are also replicated. We confirmed that the mask absorber pattern fabrication process using a wet process is useful for EUVL mask.