Inner wall coating of cylinders by plasma immersion ion implantation for corrosion protection

Inner wall coating of cylinders by plasma immersion ion implantation for corrosion protection
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等离子浸没离子注入气缸内壁涂层防腐

DOI:
10.1016/s0257-8972(00)01056-2
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发表时间:
2001
影响因子:
5.4
通讯作者:
B. Enders
B. Enders
中科院分区:
材料科学1区
文献类型:
--
作者:
W. Ensinger;K. Volz;B. Enders

文献摘要

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空心工件(例如圆柱体)通常需要在磨损和腐蚀行为方面表现出比工件制造材料更好的性能。当在内壁上沉积保护涂层时,这个问题就可以得到解决。然而,通过物理气相沉积技术涂覆内壁是困难的,因为要沉积的材料必须以与壁成非常平的角度进入中空物体,这取决于孔径与内径的比率。当要沉积的材料源位于工件内部时,可以克服这个问题。当进行离子溅射镀膜时这是可能的。溅射靶位于工件内部。从浸入工件的等离子体中提取的高能离子被加速朝向工件,进入工件并撞击到溅射靶上。因此,材料被溅射到内壁上。同时,离子撞击到生长的薄膜上并导致离子束混合效应。该技术已经用不同材料制成的圆柱体和不同溅射靶材料进行了测试。沉积的薄膜具有良好的附着力和致密性,可以作为防腐蚀的保护涂层。这显示了铁在乙酸中的腐蚀、铝在氯化钠溶液中的点蚀以及钽在盐酸中的氢脆。
Hollow workpieces such as cylinders are often required to exhibit better performance in wear and corrosion behaviour than the material the workpiece is made of can offer. The problem can be overcome when a protective coating is deposited onto the inner walls. However, coating inner walls by means of physical vapour deposition techniques is difficult because the material to be deposited has to enter the hollow object under very flat angles to the wall, depending on the ratio of aperture to inner diameter. This problem can be overcome when the source of the material to be deposited is located inside the workpiece. This is possible when sputter coating with ions is performed. A sputter target is located inside the workpiece. Energetic ions extracted from a plasma in which the workpiece is immersed are accelerated towards the workpiece, enter it and impinge onto the sputter target. Thus, material is sputtered onto the inner wall. At the same time, ions impinge onto the growing film and lead to ion beam mixing effects. This technique has been tested with cylinders made of different materials and with different sputter target materials. The deposited films are well adhering and dense and may act as protective coatings against corrosion. This is shown for corrosion of iron in acetic acid, pitting corrosion of aluminium in sodium chloride solution, and hydrogen embrittlement of tantalum in hydrochloric acid.