Significance of sensitization process in electroless deposition of Ni on nanosized Al2O3 powders

Significance of sensitization process in electroless deposition of Ni on nanosized Al2O3 powders
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纳米 Al2O3 粉末上化学镀 Ni 敏化过程的意义

DOI:
10.1016/j.ceramint.2015.11.137
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发表时间:
2016-02
影响因子:
5.2
通讯作者:
Wang Z. Q.
Wang Z. Q.
中科院分区:
材料科学1区
文献类型:
--
作者:
Pang J. N.;Jiang S. W.;Lin H.;Wang Z. Q.

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采用SnCl 2敏化和PdCl 2活化的方法,研究了Ni在直径约为150 nm的纳米α-Al 2 O3粉末上的化学沉积。通过使用NiCl 2·6 H2O、C6 H5 NaO 7·H2O、NH 4Cl和NaH 2 PO 2·H2O来制备用于无电沉积的镀液,并且在70 °C的镀液温度和8.5的pH值下进行沉积。采用扫描电子显微镜(SEM)、透射电子显微镜(TEM)和X射线衍射仪(XRD)对Ni包覆α-Al 2 O3纳米粉体的形貌、显微结构和相结构进行了表征。结果发现,敏化过程,随后重复树脂化极大地影响Ni的形态沉积在超细氧化铝颗粒上的纳米粒子的形式,不同于传统的连续化学镀膜/涂层沉积在较粗的颗粒上。SnCl_2敏化的超细α-Al_2 O_3颗粒在Pd_(Cl_2)活化前进行树脂化处理,导致在Al_2 O_3表面沉积了不同数量的直径为50-80 nm的Ni颗粒。结果表明,在敏化后的α-Al 2 O3纳米粉体上,Sn 2+向Sn 4+的氧化过程将Pd 2+向Pd的还原过程(活化)与Sn 2+的初始位置联系起来。因此,沉积的Ni的形式密切相关的还原Pd的表面分布,这可能是连续的或离散的主要取决于吸附的Sn 2+在敏化过程中的粉末的密度。通过控制SnCl 2敏化过程,在纳米α-Al 2 O3粉体上沉积不同分布结构的金属粒子是可行的。
The electroless deposition of Ni on nanosized α-Al2O3powders of about 150 nm diameter has been studied by employing SnCl2sensitization and PdCl2activation approach. The bath for electroless deposition was prepared by using NiCl2·6H2O, C6H5NaO7·H2O, NH4Cl and NaH2PO2·H2O, and the deposition was carried out at a bath temperature of 70 °C with a pH value of 8.5. The morphology, microstructure and phase structure of Ni-coated α-Al2O3nanopowders were characterized with scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffractometry (XRD), respectively. It is found that, the sensitization process followed by repetitive resining greatly affects the morphology of Ni deposited in the form of nanoparticles onto the ultrafine alumina particles, different from the conventional continuous electroless film/coating deposited on coarser particles. The resining of the SnCl2sensitized ultrafine α-Al2O3particles prior to PdCl2activation process leads to varied amount of deposited Ni particles with diameters of 50–80 nm on the Al2O3. It is revealed that, subsequent reduction process (activation) from Pd2+to Pd is linked to the original sites of Sn2+by simultaneous oxidation process from Sn2+to Sn4+on the previously sensitized α-Al2O3nanopowders. Consequently, the form of deposited Ni correlated closely to the surface distribution of reduced Pd which may be continuous or discrete determined predominantly by the density of adsorbed Sn2+on the powders during sensitization process. It demonstrates a possibility of depositing different distribution structures of metals on nanosized α-Al2O3powders through controlling SnCl2sensitization process.
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