Significance of sensitization process in electroless deposition of Ni on nanosized Al2O3 powders
Significance of sensitization process in electroless deposition of Ni on nanosized Al2O3 powders
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纳米 Al2O3 粉末上化学镀 Ni 敏化过程的意义
DOI:
10.1016/j.ceramint.2015.11.137
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发表时间:
2016-02
影响因子:
5.2
通讯作者:
Wang Z. Q.
中科院分区:
文献类型:
--
作者:
Pang J. N.;Jiang S. W.;Lin H.;Wang Z. Q.
The electroless deposition of Ni on nanosized α-Al2O3powders of about 150 nm diameter has been studied by employing SnCl2sensitization and PdCl2activation approach. The bath for electroless deposition was prepared by using NiCl2·6H2O, C6H5NaO7·H2O, NH4Cl and NaH2PO2·H2O, and the deposition was carried out at a bath temperature of 70 °C with a pH value of 8.5. The morphology, microstructure and phase structure of Ni-coated α-Al2O3nanopowders were characterized with scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffractometry (XRD), respectively. It is found that, the sensitization process followed by repetitive resining greatly affects the morphology of Ni deposited in the form of nanoparticles onto the ultrafine alumina particles, different from the conventional continuous electroless film/coating deposited on coarser particles. The resining of the SnCl2sensitized ultrafine α-Al2O3particles prior to PdCl2activation process leads to varied amount of deposited Ni particles with diameters of 50–80 nm on the Al2O3. It is revealed that, subsequent reduction process (activation) from Pd2+to Pd is linked to the original sites of Sn2+by simultaneous oxidation process from Sn2+to Sn4+on the previously sensitized α-Al2O3nanopowders. Consequently, the form of deposited Ni correlated closely to the surface distribution of reduced Pd which may be continuous or discrete determined predominantly by the density of adsorbed Sn2+on the powders during sensitization process. It demonstrates a possibility of depositing different distribution structures of metals on nanosized α-Al2O3powders through controlling SnCl2sensitization process.
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DOI:
--
发表时间:
1990
期刊:
--
影响因子:
--
作者:
G. Mallory;J. Hajdu
通讯作者:
G. Mallory;J. Hajdu
影响因子:
3.9
作者:
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通讯作者:
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影响因子:
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作者:
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通讯作者:
Z. Zhang;L. C. Zhang;Y. Mai
影响因子:
4.5
作者:
Z. Zhang;L. C. Zhang;Y. Mai
通讯作者:
Z. Zhang;L. C. Zhang;Y. Mai
影响因子:
4.6
作者:
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通讯作者:
J. Michalski;K. Konopka;M. Trzaska