Bonding of Various Metals Using Ag Metallo-Organic Nanoparticles-A Novel Bonding Process Using Ag Metallo-Organic Nanoparticles-

Bonding of Various Metals Using Ag Metallo-Organic Nanoparticles-A Novel Bonding Process Using Ag Metallo-Organic Nanoparticles-
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DOI:
10.4028/www.scientific.net/msf.512.383
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发表时间:
2006-03
期刊:
Materials Science Forum
影响因子:
--
通讯作者:
E. Ide;S. Angata-;A. Hirose;K. Kobayashi
E. Ide;S. Angata-;A. Hirose;K. Kobayashi
中科院分区:
其他
文献类型:
--
作者:
E. Ide;S. Angata-;A. Hirose;K. Kobayashi

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我们提出了一种新的键合工艺,使用银金属有机纳米粒子,其中平均粒径为11 nm左右。在本文中,Al,Ti,Ni,Cu,Ag和Au圆盘接头使用Ag金属有机纳米颗粒,以研究各种金属的可连接性。这些接头进行了评估的基础上的剪切强度的测量,并观察断口和横截面显微组织。各种金属接头的剪切强度按以下顺序增加:Al、Ti、Ni、Cu、Ag和Au。这对应于每种金属氧化物形成的标准自由能值的顺序。特别是,氧化物可被碳还原的Cu、Ag和Au接合的强度相同,而氧化物比碳氧化物更稳定的Al和Ti接合的强度极低。该结果表明,Ag金属有机纳米颗粒的有机壳分解产生的碳原子或有机元素可能在金属表面的氧化物膜的脱氧中起作用。这可以在低温下促进Ag纳米颗粒和金属之间的化学键合。
We propose a novel bonding process using Ag metallo-organic nanoparticles, of which the average particle size is around 11 nm. In this paper, Al, Ti, Ni, Cu, Ag and Au disc joints were made using the Ag metallo-organic nanoparticles in order to investigate the bondability of the various metals. These joints are evaluated based on measurement of the shear strength, and the observation of the fracture surfaces and the cross-sectional microstructures. The shear strength of the various metal joints increased in the following order: Al, Ti, Ni, Cu, Ag and Au. This corresponds to the order of the standard-free energy value of the oxide formation for each metal. In particular, while the strengths of the Cu, Ag and Au joints, in which the oxides can be reduced by carbon, were the same level, those of the Al and Ti joints, of which the oxides were more stable than carbon oxides, were extremely low. This result suggests that the carbon atoms or organic elements generated by the decomposition of the organic shell of the Ag metallo-organic nanoparticles may play a role in deoxidizing the oxide film on the metal surface. This can promote chemical bonding between the Ag nanoparticles and metals at low temperatures.