Electrically packaged silicon-organic hybrid (SOH) I/Q-modulator for 64 GBd operation.
Electrically packaged silicon-organic hybrid (SOH) I/Q-modulator for 64 GBd operation.
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DOI：
10.1364/oe.26.034580
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发表时间：
2018-07
期刊：
影响因子：
3.8
通讯作者：
H. Zwickel;J. Kemal;C. Kieninger;Y. Kutuvantavida;J. Rittershofer;M. Lauermann;W. Freude;S. Randel;C. Koos
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文献类型：
--
作者：
H. Zwickel;J. Kemal;C. Kieninger;Y. Kutuvantavida;J. Rittershofer;M. Lauermann;W. Freude;S. Randel;C. Koos
硅有机混合（SOH）电光（EO）调制器联合收割机结合了小尺寸和低工作电压，因此具有低功耗，从而有助于大规模器件阵列的片上集成。在这里，我们展示了一个电气封装的概念，使片上SOH器件和外部电路之间的高密度射频（RF）接口。该概念结合了高分辨率的氧化铝印刷电路板与技术上简单的金属引线键合，并适合于封装器件阵列与小芯片上的键合焊盘间距。在一组实验中，我们表征了底层RF构建块的性能，并通过生成高速光通信信号来证明整体概念的可行性。使用正交相移键控（QPSK）调制实现128 Gbit/s（64 GBd）的线路速率（符号速率），使用16状态正交幅度调制（16 QAM）实现160 Gbit/s（40 GBd）的线路速率，我们相信我们的演示代表了将SOH调制器从概念验证实验部署到商业环境的重要一步。
Silicon-organic hybrid (SOH) electro-optic (EO) modulators combine small footprint with low operating voltage and hence low power dissipation, thus lending themselves to on-chip integration of large-scale device arrays. Here we demonstrate an electrical packaging concept that enables high-density radio-frequency (RF) interfaces between on-chip SOH devices and external circuits. The concept combines high-resolution Al2O3 printed-circuit boards with technically simple metal wire bonds and is amenable to packaging of device arrays with small on-chip bond pad pitches. In a set of experiments, we characterize the performance of the underlying RF building blocks and we demonstrate the viability of the overall concept by generation of high-speed optical communication signals. Achieving line rates (symbols rates) of 128 Gbit/s (64 GBd) using quadrature-phase-shift-keying (QPSK) modulation and of 160 Gbit/s (40 GBd) using 16-state quadrature-amplitude-modulation (16QAM), we believe that our demonstration represents an important step in bringing SOH modulators from proof-of-concept experiments to deployment in commercial environments.