Parsing abnormal grain growth
Parsing abnormal grain growth
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DOI：
10.1016/j.actamat.2015.10.034
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发表时间：
2016-01-15
期刊：
影响因子：
9.4
通讯作者：
Rollett, A. D.
中科院分区：
文献类型：
--
作者：
Lawrence, A.;Rickman, J. M.;Rollett, A. D.
异常晶粒生长，即多晶体中少数晶粒以周围晶粒为代价的扩大，发生在金属和陶瓷材料中，并且可以对其机械和电气性能产生深远的影响。有些令人惊讶的是，对于哪些特定的显微结构特征提供了异常生长的特征，几乎没有共识。事实上，一些工作者将这种现象描述为双峰粒度分布，通常没有理由，而其他人则专注于非常少的细长颗粒。使用特种氧化铝（即，具有定制杂质组成的高纯氧化铝）作为我们的原型，我们在这里描述了一组实用的图和度量，其用于量化与异常晶粒生长相关的各种微观结构特征。这些图提供了异常生长的视觉“指纹”，而度量允许设计处理路线以获得所需的微观结构。然后，我们提出了一个相关性分析的应用程序，说明了数据分析在量化哪些输入（即，加工）变量对异常晶粒生长的影响最大。最后，我们概述了使用这种方法来检查处理变量和材料的热机械和动力学特性之间的相关性（例如，强度、硬度、导热性等）。(c)2015 Acta Materialia Inc.由Elsevier Ltd.出版。保留所有权利。
Abnormal grain growth, the enlargement of a minority of grains in a polycrystal at the expense of the surrounding grains, occurs in both metallic and ceramic materials and can have a profound impact on their mechanical and electrical properties. Somewhat surprisingly then, there is little consensus as to which specific microstructural features provide a signature of abnormal growth. Indeed, some workers describe this phenomenon in terms of a bimodal grain size distribution, often without justification, while others focus on very few, elongated grains. Using specialty alumina (i.e., high-purity aluminum oxide with tailored impurity composition) as our prototype, we describe here a set of practical maps and metrics that are useful in quantifying various microstructural features that are associated with abnormal grain growth. These maps provide a visual "fingerprint" of abnormal growth, while the metrics permit the design of processing routes to obtain desired microstructures. We then present an application of correlation analysis that illustrates the efficacy of data analytics in quantifying which input (i.e., processing) variables exert the strongest influence on abnormal grain growth. Finally, we outline the use of this methodology to examine correlations among processing variables and the thermomechanical and kinetic properties of materials (e.g., strength, hardness, thermal conductivity, etc.). (c) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.