Design of piezoelectric MEMS cantilever for low-frequency vibration energy harvester
Design of piezoelectric MEMS cantilever for low-frequency vibration energy harvester
复制标题
低频振动能量采集器压电MEMS悬臂梁设计
DOI：
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
Takeshi Kobayashi
中科院分区：
文献类型：
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作者：
R. Takei;N. Makimoto;H. Okada;T. Itoh;Takeshi Kobayashi
我们报告的压电MEMS的设计，形成在绝缘体上的硅晶片，以有效地收获电力的谐波振动频率约为30 Hz。数值模拟表明，>4 μ m厚的顶部硅层和>3 μ m厚的压电薄膜是最好的，以最大化输出电功率。悬臂的平面内结构也被设计成保持悬臂的足迹。仿真结果表明，当检测质量块与悬臂梁的长度比为1.5时，输出功率最大。为了确保模拟的准确性，我们制造并表征了具有10 μ m厚的顶部硅层和1.8 μ m厚的压电膜的悬臂梁，在0.5 m/s2和25.1 Hz的振动下产生0.21 μW。实测输出功率与仿真值吻合较好，说明该设计对于低频振动能量采集器具有显著的可靠性。
We report the design of piezoelectric MEMS cantilevers formed on a silicon-on-insulator wafer to efficiently harvest electrical power from harmonic vibration with a frequency of approximately 30 Hz. Numerical simulation indicates that a >4-µm-thick top silicon layer and >3-µm-thick piezoelectric film are preferable to maximize the output electrical power. An in-plane structure of the cantilever is also designed retaining the footprint of the cantilever. The simulation results indicate that the output power is maximized when the length ratio of the proof mass to the cantilever beam is 1.5. To ensure the accuracy of the simulation, we fabricated and characterized cantilevers with a 10-µm-thick top silicon layer and a 1.8-µm-thick piezoelectric film, resulting in 0.21 µW at a vibration of 0.5 m/s2 and 25.1 Hz. The measured output power is in agreement with the simulated value, meaning that the design is significantly reliable for low-frequency vibration energy harvesters.