Laser-Activated Selective Electroless Plating on 3D Structures via Additive Manufacturing for Customized Electronics

Laser-Activated Selective Electroless Plating on 3D Structures via Additive Manufacturing for Customized Electronics
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DOI:
10.1002/admt.202300516
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发表时间:
2023-08-02
影响因子:
6.8
通讯作者:
Han, Lei
Han, Lei
中科院分区:
材料科学2区
文献类型:
--
作者:
Wang, Peiren;Li, Ji;Han, Lei

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这项工作提出了一种简便经济的混合增材制造(HAM)技术,该技术结合了熔融沉积成型(FDM)3D打印和激光激活选择性化学镀(ELP),用于制造全功能的最终用途3D定制电子产品。开发了一种用于FDM 3D打印的掺杂氢氧化二铜磷酸盐(Cu-2(OH)PO 4)催化剂的功能性丙烯腈-丁二烯-苯乙烯(ABS)纤维。3D打印结构被选择性地激光激活以在ABS表面上产生Cu-I电镀种子,然后进行无电镀。表面光洁度差,特别是层线,是挤出3D打印的固有缺陷,它不仅影响3D基板的制造质量,还影响所附电路的电气性能。在此,探索和表征基于丙酮蒸气的化学抛光工艺,以显著改善表面质量,从而改善附着的铜层的电性能。以这种方式,高导电性金属电路可以自由地沉积并图案化在3D结构上,这对于定制的3D电子器件非常有吸引力。为了展示该技术的应用潜力,开发了三维共形555定时器非稳振荡器电路板和热线流量计作为演示。
This work proposes a facile and economical hybrid additive manufacturing (HAM)technology combining fused deposition modeling (FDM) 3D printing and laser-activated selective electroless plating (ELP) for fabricating full functional end-use 3D customized electronics. A functional acrylonitrile butadiene styrene (ABS) filament doped with dicopper hydroxide phosphate (Cu-2(OH)PO4) catalysts is developed for FDM 3D printing. The 3D printed structure is selectively laser-activated to generate Cu-I plating seeds on the ABS surface and then electrolessly plated. The poor surface finish, especially the layer lines, is an intrinsic defect of extrusion 3D printing, which not only affected the fabrication quality of the 3D substrates but also the electrical performance of the attached circuitry. Herein, a chemical polishing process based on acetone vapor is explored and characterized to significantly improve the surface quality and thereby the electrical performance of the attached copper layer. In this way, highly conductive metallic circuitry can be freeformly deposited and patterned on the 3D structure which is extremely attractive for customized 3D electronics. To show the application potential of this technology, a 3D conformal 555 timer astable oscillator circuit board and a hot-wire flowmeter are developed as demonstrators.