Precursor film controlled wetting of Pb on Cu.
Precursor film controlled wetting of Pb on Cu.
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DOI：
10.1103/physrevlett.91.236102
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发表时间：
2003-12
影响因子：
8.6
通讯作者：
E. Webb;G. Grest;D. Heine
中科院分区：
文献类型：
--
作者：
E. Webb;G. Grest;D. Heine
润湿液滴扩散的动力学控制的前体膜的形成速率的系统中建模为第一次在原子尺度。Pb（1）润湿Cu（111）和Cu（100）的分子动力学模拟表明，原子厚度的前体膜的演化和扩散。该前体膜在Cu（111）上比在Cu（100）上显著更快地扩展。对于Cu（100），液滴扩展的动力学通过前体膜的缓慢推进而显著降低。Cu（100）上缓慢的前体膜动力学部分是由于在固-液界面处形成表面合金，这在Cu（111）上不发生。
Wetting in a system where the kinetics of drop spreading are controlled by the rate of formation of a precursor film is modeled for the first time at the atomistic scale. Molecular dynamics simulations of Pb(l) wetting Cu(111) and Cu(100) show that a precursor film of atomic thickness evolves and spreads diffusively. This precursor film spreads significantly faster on Cu(111) than on Cu(100). For Cu(100), the kinetics of drop spreading are dramatically decreased by slow advancement of the precursor film. Slow precursor film kinetics on Cu(100) are partly due to the formation of a surface alloy at the solid-liquid interface which does not occur on Cu(111).