A New, Computationally Efficient “Blech Criterion” for Immortality in General Interconnects
A New, Computationally Efficient “Blech Criterion” for Immortality in General Interconnects
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DOI：
10.1109/dac18074.2021.9586127
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发表时间：
2021-05
期刊：
影响因子：
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通讯作者：
Mohammad Abdullah Al Shohel;V. A. Chhabria;S. Sapatnekar
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文献类型：
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作者：
Mohammad Abdullah Al Shohel;V. A. Chhabria;S. Sapatnekar
分析 VLSI 电路中电迁移 (EM) 的传统方法首先使用 Blech 准则过滤不朽的导线，然后对剩余导线进行详细的 EM 分析。然而，Blech 的标准是针对两端电线设计的，并不适用于一般结构。本文展示了一种基于第一原理的求解技术，用于确定通用互连结构所有节点处的稳态应力，并开发了一种永生性测试，其复杂性与互连结构的边数呈线性关系。所提出的模型适用于各种结构。该方法被证明与数值求解器的结果非常匹配，可以扩展到大型结构。
Traditional methodologies for analyzing electromigration (EM) in VLSI circuits first filter immortal wires using Blech’s criterion, and then perform detailed EM analysis on the remaining wires. However, Blech’s criterion was designed for two-terminal wires and does not extend to general structures. This paper demonstrates a first-principles-based solution technique for determining the steady-state stress at all the nodes of a general interconnect structure, and develops an immortality test whose complexity is linear in the number of edges of an interconnect structure. The proposed model is applied to a variety of structures. The method is shown to match well with results from numerical solvers, to be scalable to large structures.