3D printing electronic components and circuits with conductive thermoplastic filament
3D printing electronic components and circuits with conductive thermoplastic filament
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DOI：
10.1016/j.addma.2017.10.002
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发表时间：
2017-12-01
影响因子：
11
通讯作者：
Wiley, Benjamin J.
中科院分区：
文献类型：
--
作者：
Flowers, Patrick F.;Reyes, Christopher;Wiley, Benjamin J.
这项工作研究了双材料熔丝制造用于3D打印电子元件和电路的导电热塑性长丝的使用。发现由导电热塑性细丝印刷的迹线的电阻率分别为12、0.78和0.014 Ω cm，所述导电热塑性细丝由炭黑、石墨烯和铜作为导电填料制成，使得能够产生具有跨越3个数量级的值的电阻器。炭黑和石墨烯的纤维很脆，很容易断裂，但铜基纤维可以弯曲至少500次，电阻变化不大。对热塑性长丝进行的阻抗测量表明，铜基长丝在大于1MHz的频率下具有与铜PCB迹线类似的阻抗。双材料3D打印用于制造各种电感器和电容器，其特性可以通过修改组件的几何形状或用于制造组件的材料来可预测地调整。将这些电阻器、电容器和电感器组合在一起，创建了一个完全3D打印的高通滤波器，其性能与传统的高通滤波器相当。铜基灯丝的相对低的阻抗使其能够用于无线电力传输的接收器线圈的3D打印。我们还展示了在3D打印物体中嵌入和连接表面安装组件的能力，这是一种低成本（1000美元的部件），开源的双材料3D打印机。因此，这项工作证明了FFF 3D打印创建由嵌入式或完全打印的电子元件组成的复杂三维电路的潜力。(C)2017爱思唯尔B.V.保留所有权利。
This work examines the use of dual-material fused filament fabrication for 3D printing electronic components and circuits with conductive thermoplastic filaments. The resistivity of traces printed from conductive thermoplastic filaments made with carbon-black, graphene, and copper as conductive fillers was found to be 12, 0.78, and 0.014 Omega cm, respectively, enabling the creation of resistors with values spanning 3 orders of magnitude. The carbon black and graphene filaments were brittle and fractured easily, but the copper-based filament could be bent at least 500 times with little change in its resistance. Impedance measurements made on the thermoplastic filaments demonstrate that the copper-based filament had an impedance similar to a copper PCB trace at frequencies greater than 1 MHz. Dual material 3D printing was used to fabricate a variety of inductors and capacitors with properties that could be predictably tuned by modifying either the geometry of the components, or the materials used to fabricate the components. These resistors, capacitors, and inductors were combined to create a fully 3D printed high-pass filter with properties comparable to its conventional counterparts. The relatively low impedance of the copper-based filament enabled its use for 3D printing of a receiver coil for wireless power transfer. We also demonstrate the ability to embed and connect surface mounted components in 3D printed objects with a low-cost ($1000 in parts), open source dual-material 3D printer. This work thus demonstrates the potential for FFF 3D printing to create complex, three-dimensional circuits composed of either embedded or fully-printed electronic components. (C) 2017 Elsevier B.V. All rights reserved.