Poly(vinylidene fluoride) foams: a promising low-k dielectric and heat-insulating material
Poly(vinylidene fluoride) foams: a promising low-k dielectric and heat-insulating material
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DOI：
10.1039/c8tc00547h
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发表时间：
2018-03
影响因子：
6.4
通讯作者：
Biao Zhao;Chongxiang Zhao;Chongda Wang;Chul B. Park
中科院分区：
文献类型：
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作者：
Biao Zhao;Chongxiang Zhao;Chongda Wang;Chul B. Park
在本研究中，我们采用批量发泡方法制备了具有定制微孔结构的闭孔聚偏氟乙烯（PVDF）泡沫。这是一种简单、经济、环保的方法，它提供了广泛的可调微细胞结构。在饱和温度下，可以有效地监测PVDF泡沫的孔大小和孔隙率。在169.5°C下制备的PVDF泡沫具有k ~ 1.1的超低介电常数和0.027 W m−1 k−1的导热系数。利用多种理论模型对微孔PVDF泡沫的有效介电常数进行了预测，发现Bruggeman模型与实测结果非常接近。PVDF泡沫的超低导热系数是由于其微孔结构中存在大量的气穴。基于这些结果，我们得出结论，PVDF泡沫将是一种有前途的低k介电和隔热材料。
In this study, we used a batch-foaming method to prepare closed-cell poly(vinylidene fluoride) (PVDF) foams with tailored microcellular structures. This is a simple, cost-effective, and environmentally-friendly method, and it offers a wide range of tunable microcellular structures. The cell size and porosity volume of PVDF foams can be effectively monitored at their saturation temperatures. The PVDF foam prepared at 169.5 °C possesses an ultra-low dielectric constant of k ∼ 1.1 and a thermal conductivity of 0.027 W m−1 K−1. We used numerous theoretical models to predict the effective dielectric permittivity of the microcellular PVDF foams, and found that the Bruggeman model was very close to the measured results. The ultra-low thermal conductivities of the PVDF foams were the result of a large number of air pockets in the microcellular structure. Based on these results, we concluded that this PVDF foam would be a promising low-k dielectric and heat insulating material.