Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections
Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections
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DOI：
10.1109/iccad51958.2021.9643570
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发表时间：
2021-11
期刊：
影响因子：
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通讯作者：
Mohammad Abdullah Al Shohel;V. A. Chhabria;N. Evmorfopoulos;S. Sapatnekar
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文献类型：
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作者：
Mohammad Abdullah Al Shohel;V. A. Chhabria;N. Evmorfopoulos;S. Sapatnekar
在IC的整个使用寿命期间，测试多段互连中的电迁移（EM）故障的传统方法是基于使用Blech准则，然后是Black方程。这种方法独立地分析每个段，但是众所周知由于多个段上的应力积累而不准确。本文介绍了应力流边界反射的新概念，它对有限多段线中的瞬态应力行为作出了物理（类波）解释。这可以提供用于导出具有任何数量的段的线路的瞬态EM应力的分析表达式的框架，其也可以被定制为包括用于任何期望的准确度水平的适当数量的项。所提出的方法具有良好的精度，通过对有限元求解器COMSOL的评估，以及可扩展性，通过其在大型电网基准的应用。
Traditional methods that test for electromigration (EM) failure in multisegment interconnects, over the lifespan of an IC, are based on the use of the Blech criterion, followed by Black's equation. Such methods analyze each segment independently, but are well known to be inaccurate due to stress buildup over multiple segments. This paper introduces the new concept of boundary reflections of stress flow that ascribes a physical (wave-like) interpretation to the transient stress behavior in a finite multisegment line. This can provide a framework for deriving analytical expressions of transient EM stress for lines with any number of segments, which can also be tailored to include the appropriate number of terms for any desired level of accuracy. The proposed method is shown to have excellent accuracy, through evaluations against the FEM solver COMSOL, as well as scalability, through its application on large power grid benchmarks.