Electroless nickel plating
Electroless nickel plating
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DOI：
10.1179/imr.1992.37.1.196
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发表时间：
1992
影响因子：
16.1
通讯作者：
L. Brown
中科院分区：
文献类型：
--
作者：
L. Brown
描述：化学镀镍是指将镍离子和磷离子水溶液自动催化（或化学）还原到基底上。该工艺与电解电镀的不同之处在于不需要电流。化学镀镍工艺提供的沉积物完全遵循基材的轮廓。边缘或角落没有堆积物。锋利的边缘接收与盲孔相同厚度的沉积物。这种一致性是有局限性的。表面必须连续暴露于新鲜的电镀液中。例如，零件的内部空腔可能需要对溶液进行特殊泵送。
Description: Electroless Nickel refers to the autocatalytic (or chemical) reduction of the aqueous nickel and phosphorous ions onto a base substrate. The process differs from electrolytic plating in that no electrical current is required. The electroless nickel process provides a deposit that follows the contours of the substrate exactly. There is no build-up on edges or corners. A sharp edge receives the same thickness of deposit as a blind hole. There are limitations to this uniformity. The surface must be exposed to a continuous fresh supply of the plating solution. For example, internal cavities in a part may require special pumping of the solution.