Quality Assurance methodology for the ATLAS Inner Tracker strip sensor production
Quality Assurance methodology for the ATLAS Inner Tracker strip sensor production
复制标题
ATLAS Inner Tracker 条形传感器生产的质量保证方法
DOI：
10.1016/j.nima.2020.164521
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发表时间：
2020
影响因子：
1.4
通讯作者：
Y. Unno
中科院分区：
文献类型：
--
作者：
M. Ullán;P. Allport;K. Dette;V. Fadeyev;J. Fernandez;C. Fleta;L. Gonella;I. Kopsalis;R. Orr;Y. Unno
ATLAS 内部跟踪器 (ITk) 的条形传感器的生产将于 2020 年开始。Hamamatsu Photonics K.K. 将在大约五年内生产近 22,000 个大面积传感器。 （HPK）。参与传感器开发和生产的研究所致力于为实验提供和维护最高质量的传感器。已准备好在整个生产期间实施质量保证（QA）策略。一旦工艺被描述为提供所需的预辐照规格和适当的辐射硬度，制造商就有责任严格遵守合格的工艺。尽管如此，特定器件元件结构的样品测试和器件的辐照仍应由ITk传感器协作来实施。ATLAS-ITk协作已经制定了详细的辐照和测试计划，以及新设计的特定结构的测试芯片，以监测整个生产过程中的不同关键技术和器件参数。测试和辐照将在样品的基础上进行。为了获得实用的方法，交替批次的样品将被送去接受质子、中子和伽马射线照射，然后进行测试以检查特性是否符合规格。本文介绍了测试芯片中各结构的详细方案以及设计和测试方法。
The production of the strip sensors for the ATLAS Inner Tracker (ITk) will start in 2020. Nearly 22,000 large area sensors will be produced over a period of about five years by Hamamatsu Photonics K.K. (HPK). The institutes involved in the sensor development and production are committed to deliver and maintain the highest quality sensors for the experiment. A Quality Assurance (QA) strategy has been prepared to be carried out during the whole production period. Once the process has been characterized as providing the required pre-irradiation specifications and the proper radiation hardness, the onus is on the manufacturer to rigidly stick to that qualified process. Still, sample testing with specific device-element structures and irradiation of devices should be implemented by the ITk sensor collaboration.A detailed irradiation and testing plan has been prepared by the ATLAS-ITk Collaboration, together with a newly designed test chip with specific structures to monitor different key technological and device parameters during the whole production. The tests and irradiations will be carried out on a sample basis. In order to have a practical methodology, samples from alternating batches will be sent for irradiations with protons, neutrons and gammas, and then tested in order to check that the characteristics remain within specifications. The detailed plan and the design and test methods for the structures in the test chip are presented here.