300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB
300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB
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多层玻璃环氧树脂 PCB 上具有内置波导过渡的 300GHz CMOS 发射器模块
DOI：
10.1109/rws.2018.8304972
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发表时间：
2018
期刊：
影响因子：
--
通讯作者：
M. Fujishima
中科院分区：
文献类型：
--
作者：
K. Takano;K. Katayama;S. Hara;R. Dong;K. Mizuno;Kazuaki Takahashi;A. Kasamatsu;T. Yoshida;S. Amakawa;M. Fujishima
介绍了一种采用WR-3.4波导接口的300 GHz CMOS发射模块。CMOS发射器倒装芯片安装在一个低成本的多层玻璃环氧树脂印刷电路板（PCB）和一个传输线到波导的过渡与背短路结构的多层PCB构建。发射器模块的实测输出功率和3 dB带宽分别约为−13.5 dBm和10 GHz。使用该模块实现了5cm以上48 Gbit/s的无线数据速率，具有16-QAM。
A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately −13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.