Phase-field modeling of reactive wetting and growth of the intermetallic Al2Au phase in the Al-Au system
Phase-field modeling of reactive wetting and growth of the intermetallic Al2Au phase in the Al-Au system
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DOI：
10.1016/j.actamat.2017.12.015
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发表时间：
2018-03
期刊：
影响因子：
9.4
通讯作者：
Fei Wang;A. Reiter;M. Kellner;J. Brillo;M. Selzer;B. Nestler
中科院分区：
文献类型：
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作者：
Fei Wang;A. Reiter;M. Kellner;J. Brillo;M. Selzer;B. Nestler
当Al液滴与Au固体基底接触时，液相与基底反应，并且由于扩散和反应在固液界面处形成金属间化合物层。这种现象在焊接过程中经常被观察到，并且润湿被称为反应性润湿，与其中液滴不与基底材料反应并且基板是平坦的惰性润湿相反。杨氏定律可以用来解释静态接触角，但不能用来预测反应润湿过程中的动态接触角。在这项工作中，我们提出了一个多相模型，包括相变和流体动力学研究金属间化合物Al 2Au相的形成和毛细流动的影响，在Al-Au系统的反应润湿。为了捕捉固体，液体和金属间化合物-蒸气的相边界，相场模拟进行基于三元（Al-Au-X）相图的概念和使用实验数据。结果表明，液相-金属间化合物界面张力的增加和毛细管流动对金属间化合物相的生长有抑制作用。
When an Al-droplet is in contact with an Au-solid substrate, the liquid phase reacts with the substrate and an intermetallic layer is formed at the solid-liquid interface due to diffusion and reaction. This phenomenon has been commonly observed in the soldering process and the wetting is termed as reactive wetting, in contrast to the inert wetting where the droplet does not react with the base materials and the substrate is flat. Young's law can be used to interpret the contact angle in the static state, but is not able to predict the dynamics in the process of reactive wetting. In this work, we present a multi-phase model including phase transition and fluid dynamics to investigate the effect of the formation of the intermetallic Al2Au phase and capillary flow on the reactive wetting in the Al-Au system. In order to capture phase boundaries of solid-, liquid- and intermetallic-vapor, phase-field simulations are performed based on a ternary (Al-Au-X) phase diagram concept and using experimental data. It has been found that the increase of both the liquid-intermetallic interfacial tension as well as the capillary flow lead to an inhibition effect for the growth of the intermetallic phase.