In Situ Diagnostics and Prognostics of Solder Fatigue in IGBT Modules for Electric Vehicle Drives
In Situ Diagnostics and Prognostics of Solder Fatigue in IGBT Modules for Electric Vehicle Drives
复制标题
DOI：
10.1109/tpel.2014.2318991
复制
发表时间：
2015-03-01
影响因子：
6.7
通讯作者：
Pierce, Gareth
中科院分区：
文献类型：
--
作者：
Ji, Bing;Song, Xueguan;Pierce, Gareth
本文提出了一种原位诊断和预测（D&P）技术，以监测绝缘栅双极晶体管（IGBT）的健康状况，重点是IGBT的焊料层疲劳。IGBT的热阻抗和结温可用作全寿命状态监测（CM）的健康指标，其中测量端子特性，并采用器件的内部温度敏感参数作为温度传感器来估计结温。一个辅助电源单元，可以从电池的12 V直流电源转换，为现场测试电路提供电源，CM数据可以存储在板载数据记录器中，用于进一步的离线分析。所提出的方法进行了实验验证开发的测试电路，并与有限元热电模拟。并将热循环试验结果与声显微镜和热像进行了比较。所开发的电路被证明是有效的，以检测焊料疲劳，而每个IGBT的转换器可以在红灯停止或服务期间依次检查。D&P电路可以利用现有的板载硬件并嵌入IGBT的栅极驱动单元中。
This paper proposes an in situ diagnostic and prognostic (D&P) technology to monitor the health condition of insulated gate bipolar transistors (IGBTs) used in EVs with a focus on the IGBTs' solder layer fatigue. IGBTs' thermal impedance and the junction temperature can be used as health indicators for through-life condition monitoring (CM) where the terminal characteristics are measured and the devices' internal temperature-sensitive parameters are employed as temperature sensors to estimate the junction temperature. An auxiliary power supply unit, which can be converted from the battery's 12-V dc supply, provides power to the in situ test circuits and CM data can be stored in the on-board data-logger for further offline analysis. The proposed method is experimentally validated on the developed test circuitry and also compared with finite-element thermoelectrical simulation. The test results from thermal cycling are also compared with acoustic microscope and thermal images. The developed circuitry is proved to be effective to detect solder fatigue while each IGBT in the converter can be examined sequentially during red-light stopping or services. The D&P circuitry can utilize existing on-board hardware and be embedded in the IGBT's gate drive unit.