Internal space charge and ionic migration in a printed wiring board
Internal space charge and ionic migration in a printed wiring board
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印刷线路板中的内部空间电荷和离子迁移
DOI：
10.1109/ceidp.1998.732967
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发表时间：
1998
期刊：
影响因子：
--
通讯作者：
K. Okamoto
中科院分区：
文献类型：
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作者：
K. Fukunaga;T. Maeno;K. Okamoto
内部空间电荷及其对电气绝缘的影响正在被广泛讨论，但这些讨论仅限于高压设备中使用的材料，例如高压直流电缆的绝缘。我们使用的空间电荷观察调查发生在逆变器电路的金属基印刷线路板的绝缘层中的铜离子迁移，并比较了空间电荷行为与离子杂质检测的离子色谱和铜分布观察到的电子探针X射线微量分析仪。老化试验期间测得的空间电荷分布表明，产生内部负电荷，并在直流电场下的铜电极附近形成高导电区域。高导电区与铜离子迁移区相同。因此，我们发现，空间电荷的观察是有用的研究印刷线路板的老化现象。
Internal space charge and its influence on electrical insulation are being widely discussed, but these discussions have been limited to materials used in high-voltage apparatus, such as the insulation for high-voltage dc cables. We used the space charge observation to investigate copper ion migration occurring in an insulation layer of a metal-base printed wiring board for inverter circuits, and compared the space charge behaviour with ion impurities detected by ion chromatography and copper distribution observed by an electron probe X-ray microanalyser. The space charge profiles measured during an ageing test suggested that internal negative charges were generated, and that a high conductive region was formed near the copper electrode under dc electric field. The high conductive region was the same as that with the copper ion migration. Thus we found that space charge observation is useful for investigating the ageing phenomena of a printed wiring board.