Microfluidic chips fabrication from UV curable adhesives for heterogeneous integration
Microfluidic chips fabrication from UV curable adhesives for heterogeneous integration
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DOI：
10.1109/ectc.2012.6249109
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发表时间：
2012-07
期刊：
影响因子：
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通讯作者：
V. Mokkapati;O. Bethge;R. Hainberger;H. Brueckl
中科院分区：
文献类型：
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作者：
V. Mokkapati;O. Bethge;R. Hainberger;H. Brueckl
微流控芯片的常规制造基于硅、玻璃、PDMS和各种其他聚合物材料（COC、聚碳酸酯、PMMA等）。硅和玻璃加工技术高度发达，芯片可以轻松制造。近年来，由于对廉价和一次性装置的需求，聚合物微流控芯片变得非常普遍。该领域的新成员是紫外线固化粘合剂，它们作为微流体领域有前途的参与者而获得认可。UV可固化粘合剂通常用于各种应用中，从用于制造飞机部件到密封/包装微流体芯片。与任何其他先前讨论的材料不同，UV固化粘合剂在制造过程中具有对齐和粘合的灵活性。这些粘合剂可以应用于待胶合的两个表面之间，并且只要胶水不暴露于UV光，就可以像这样放置数小时至数天而不粘合它们。在本文中，我们解释了微流控芯片（100μm宽，3μm（NOA 74），22μm（NOA 68）深）完全由UV固化胶粘剂具有更好的耐化学性，渗透性和灵活的表面处理相比，其他已知的聚合物材料的详细制作。首先在硅上蚀刻图案，然后进行PDMS模塑，随后在结构化PDMS母版上浇铸并固化UV可固化粘合剂。脱模后，将印模安装在玻璃基板上，并通过进一步的UV处理和/或氧等离子体处理实现永久结合。成功测试了最终器械的任何泄漏。这些微流控芯片将与传感器和天线集成，用于进一步的生物学研究。UV固化粘合剂也用于微流体通道的永久/临时密封。这些粘合剂，仍然是新的流体分支，可以在功能上和经济上，有更大的影响微流体。
Conventional fabrication of microfluidic chips is based on silicon, glass, PDMS and various other polymeric materials (COC, polycarbonate, PMMA etc). Silicon and glass processing technologies are highly developed and the chips can be fabricated with ease. Polymeric microfluidic chips have become very common in recent years due to the demand for the cheap and disposable devices. New entrants in to the field are UV curable adhesives which are gaining recognition as promising players in microfluidics. UV curable adhesives are generally used in various applications ranging from usage in the manufacture of parts of an aircraft to sealing/packaging of microfluidic chips. Unlike any other previously discussed materials UV curable adhesives have the flexibility in alignment and bonding during fabrication process. These adhesives can be applied in between two surfaces which are to be glued and can be left like that for hours to days without bonding them as long as the glue is not exposed to UV light. In this paper we explain the detailed fabrication of microfluidic chips (100μm wide and 3μm (NOA74), 22μm (NOA 68) deep) completely made from UV curable adhesives having better chemical resistance, permeability and flexible surface treatments compared to other known polymeric materials. Firstly the patterns were etched on silicon, followed by PDMS molding and subsequently UV curable adhesives were casted and cured on structured PDMS master. After unmolding the stamps were mounted on a glass substrate and permanent bonding was achieved by further UV treatment and/or oxygen plasma treatment. The final devices were successfully tested for any leakage. These microfluidic chips will be integrated with a sensor and antenna for further biological studies. UV curable adhesives are also used for permanent/temporary sealing of microfluidic channels. These adhesives, which are still new to the fluidics branch can functionally and economically, have a greater impact on microfluidics.