Dendrite coherency of Al-Si-Cu alloys
Dendrite coherency of Al-Si-Cu alloys
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DOI：
10.1007/s11661-001-0110-1
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发表时间：
2001
期刊：
影响因子：
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通讯作者：
N. Veldman;A. Dahle;D. StJohn;L. Arnberg
中科院分区：
文献类型：
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作者：
N. Veldman;A. Dahle;D. StJohn;L. Arnberg
采用热分析和流变测量方法，对不同硅、铜含量的铝合金在两种冷却速率下进行平行测量，确定了Al-Si-Cu合金的枝晶凝聚点。与以前的研究结果相反，这两种方法产生显着不同的值在枝晶相干点的固体分数。对于低溶质浓度的合金，这种差异最大。从这项研究的结果也矛盾以前报道的趋势，冷却速度的影响，树枝状的相干点。考虑的结果表明，热分析是不是一个有效的技术测量的相干性。流变测试结果的分析表明，硅浓度对晶粒尺寸和枝晶形态具有主导作用，与冷却速率和铜含量无关，因此是决定Al-Si-Cu合金枝晶相干性的固体分数的因素。
The dendrite coherency point of Al-Si-Cu alloys was determined by thermal analysis and rheological measurement methods by performing parallel measurements at two cooling rates for aluminum alloys across a wide range of silicon and copper contents. Contrary to previous findings, the two methods yield significantly different values for the fraction solid at the dendrite coherency point. This disparity is greatest for alloys of low solute concentration. The results from this study also contradict previously reported trends in the effect of cooling rate on the dendritic coherency point. Consideration of the results shows that thermal analysis is not a valid technique for the measurement of coherency. Analysis of the results from rheological testing indicates that silicon concentration has a dominant effect on grain size and dendritic morphology, independent of cooling rate and copper content, and thus is the factor that determines the fraction solid at dendrite coherency for Al-Si-Cu alloys.