Investigation of single-layer and multilayer coatings for aluminum bipolar plate in polymer electrolyte membrane fuel cell
Investigation of single-layer and multilayer coatings for aluminum bipolar plate in polymer electrolyte membrane fuel cell
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聚合物电解质膜燃料电池铝双极板单层和多层涂层的研究
DOI：
10.1016/j.ijhydene.2014.03.136
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发表时间：
2014-05
影响因子：
7.2
通讯作者：
Wu, Yixiong
中科院分区：
文献类型：
--
作者：
Wang, Zhiyuan;Cai, Xun;Yao, Chengwu;Wu, Yixiong
Aluminum bipolar plates offer good mechanical performance and availability for mass production while allow up to 65% lighter than stainless steel. To improve the corrosion resistance and surface electrical conductivity of aluminum bipolar plates, several coatings, including TiN, CrN, C, C/TiN and C/CrN, are deposited on aluminum alloy 5052 (AA-5052) by close field unbalanced magnetron sputter ion plating. Scanning electron microscope (SEM) results show that the coatings containing carbon layer are denser than TiN and CrN. Although the potentiodynamic test results show improved corrosion resistance by all the coatings, the potentiostatic test results reveal different stability of these coatings in PEMFC environments. Comparing the SEM images of these coatings after potentiostatic test, C/CrN multilayer coating exhibits the best stability. C/CrN multilayer coated AA-5052 has the lowest metal ion concentration after potentiostatic test, being 11.12 ppm and 1.29 ppm in PEMFC cathodic and anodic environments, respectively. Furthermore, the interfacial contact resistance (ICR) of the bare AA-5052 is decreased from 61.58 mΩ-cm2to 4.08 mΩ-cm2by C/CrN multilayer coating at the compaction force of 150 N-cm−2. Therefore, C/CrN multilayer coating is a good choice for surface modification of aluminum bipolar plate.
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影响因子：
3.3
作者：
Hou, Kung-Hsu;Lin, Chien-Hung;Chou, Hsi-Ming
通讯作者：
Chou, Hsi-Ming
影响因子：
9.2
作者：
C. Bai;Y. Chou;C. Chao;Shuo-Jen Lee;M. Ger
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C. Bai;Y. Chou;C. Chao;Shuo-Jen Lee;M. Ger
影响因子：
7.2
作者：
Husby, Hans;Kongstein, Ole Alvard;Seland, Frode
通讯作者：
Seland, Frode
影响因子：
7.2
作者：
Youngchul Park;Sehee Lee;Sang-Kyung Kim;Seongyop Lim;D. Jung;Se-Young Choi;Jong-hee Kim;D. Peck
通讯作者：
Youngchul Park;Sehee Lee;Sang-Kyung Kim;Seongyop Lim;D. Jung;Se-Young Choi;Jong-hee Kim;D. Peck
影响因子：
7.2
作者：
C. Jin;C. Kang
通讯作者：
C. Jin;C. Kang