Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics
Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics
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用于印刷电子产品的铜纳米粒子在环境条件下的反应烧结
DOI：
10.1021/acsomega.0c01678
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发表时间：
2020-06-09
期刊：
影响因子：
4.1
通讯作者：
Wang, Tao
中科院分区：
文献类型：
--
作者：
Dai, Xiaofeng;Zhang, Teng;Wang, Tao
提出了一种新的方法，以克服氧化和苛刻的烧结条件的铜纳米粒子（铜NP）导电油墨的缺点，同时。在此过程中，吸附在颗粒上的油胺（OAM）通过在醇中的甲酸的反应脱附被有效地去除，同时，在表面上生成铜离子。OAM的脱附导致Cu NPs的更严重的表面氧化。分布在Cu NP表面的氧化物（Cu2O）和Cu 2+可被NaBH 4溶液还原为Cu（0），并起到助焊剂的作用，将颗粒焊接成块状结构。在无氧化物的情况下，金属图形的电阻率可以降低到20 μΩ·cm以下，并具有适当的附着力。由于铜纳米颗粒在环境条件下的烧结，导电图案可以容易地形成在热敏基板上。由于Cu的氧化态在烧结过程中会被还原，因此部分氧化的Cu纳米颗粒可以直接应用于导电油墨。
A new approach is presented to overcome the disadvantages of oxidation and harsh sintering conditions of Cu nanoparticle (Cu NP) conductive inks simultaneously. In this process, oleylamine (OAM) adsorbed on particles was effectively eliminated via the reactive desorption by formic acid in alcohols; meanwhile, Cu ion was generated on the surface. The desorption of OAM resulted in more severe surface oxidation of Cu NPs. The oxide (Cu2O) and Cu2+ distributed on the Cu NP surface could be reduced to Cu(0) by NaBH4 solution and take on the role of soldering flux to weld particles into a blocky structure. With the compact coalescence of particles without oxides, the resistivity of metal patterns could fall below 20 μΩ·cm and exhibit proper adhesion. Thanks to the sintering of Cu NPs at ambient conditions, the conductive patterns could be facilely formed on thermosensitive substrates. As the oxide state of Cu would be reduced during sintering, the partially oxidized Cu nanoparticles could be directly applied to conductive inks.