Dynamic conducting crack propagation in piezoelectric materials: Mode-II problem
Dynamic conducting crack propagation in piezoelectric materials: Mode-II problem
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DOI：
10.1007/s11431-015-5795-2
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发表时间：
2015-04
期刊：
影响因子：
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通讯作者：
Haosen Chen;Wei-yi Wei-Wei-yi-Wei-2149192147;Jinxi Liu;D. Fang
中科院分区：
文献类型：
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作者：
Haosen Chen;Wei-yi Wei-Wei-yi-Wei-2149192147;Jinxi Liu;D. Fang
研究了突然面内剪切载荷作用下压电固体中导电裂纹的动态扩展。基于积分变换方法和Wiener-Hopf技术，求解了混合边值问题。导出了II型情况下的动应力强度因子和动电位移强度因子的解析解。此外，还给出了数值结果来说明裂纹动态扩展的特征。结果表明，当裂纹扩展速度等于广义瑞利速度时，动应力和电位移强度因子的通用函数消失。结果表明，确定的机电耦合系数对通用函数和应力强度因子历史具有重要意义。
This paper studies the dynamic conducting crack propagation in piezoelectric solids under suddenly in-plane shear loading. Based on the integral transform methods and the Wiener-Hopf technique, the resulting mixed boundary value problem is solved. The analytical solutions of the dynamic stress intensity factor and dynamic electric displacement intensity factor for the Mode II case are derived. Furthermore, the numerical results are presented to illustrate the characteristics of the dynamic crack propagation. It is shown that the universal functions for the dynamic stress and electric displacement intensity factors vanish if the crack propagation speed equals the generalized Rayleigh speed. The results indicate that the defined electro-mechanical coupling coefficient is of great importance to the universal functions and stress intensity factor history.