Electrochemical behavior and underpotential deposition of Sm on reactive electrodes (Al, Ni, Cu and Zn) in a LiCl-KCl melt

Electrochemical behavior and underpotential deposition of Sm on reactive electrodes (Al, Ni, Cu and Zn) in a LiCl-KCl melt
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DOI:
10.1007/s12613-020-2112-2
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发表时间:
2020-10
期刊:
International Journal of Minerals, Metallurgy and Materials
影响因子:
--
通讯作者:
Tai-qi Yin;Lang Chen;Yun Xue;Yang-hai Zheng;Xuepeng Wang;Yong-De Yan;Milin Zhang;Guiling Wang
Tai-qi Yin;Lang Chen;Yun Xue;Yang-hai Zheng;Xuepeng Wang;Yong-De Yan;Milin Zhang;Guiling Wang
中科院分区:
其他
文献类型:
--
作者:
Tai-qi Yin;Lang Chen;Yun Xue;Yang-hai Zheng;Xuepeng Wang;Yong-De Yan;Milin Zhang;Guiling Wang

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通过在铝、镍、铜和液态锌等不同电极上形成合金,从LiCl-KCl熔体中提取Sm,并用不同的电化学技术研究了生成的金属产物的电化学行为。在惰性电极上没有观察到通过常规两步反应过程沉积的金属Sm,但由于后者的去极化效应,在反应电极上观察到了欠电位沉积。反应电极对Sm的去极化作用顺序为:Zn≫Al≫Ni≫Cu。采用恒电流法和恒电位法分别制备了Sm-M(M=Al、Ni、Cu、Zn)合金。用X射线衍射仪(X射线衍射仪)和扫描电子显微镜(SEM)-能谱仪(EDS)对产物进行了全面的表征,并对所得富M化合物的稳定性进行了测定。最后,根据观察到的电化学性质和电沉积情况,对电极电位与形成的Sm-M金属间化合物的类型之间的关系进行了评估。
Sm extraction from a LiCl-KCl melt was carried out by forming alloys on various electrodes, including Al, Ni, Cu, and liquid Zn, and the electrochemical behaviors of the resultant metal products were investigated using different electrochemical techniques. While Sm metal deposition via the conventional two-step reaction process was not noted on the inert electrode, underpotential deposition was observed on the reactive electrodes because of the latter’s depolarization effect. The depolarization effects of the reactive electrodes on Sm showed the order Zn > Al > Ni > Cu. Sm-M (M = Al, Ni, Cu, Zn) alloys were deposited by galvanostatic and potentiostatic electrolysis. The products were fully characterized by X-ray diffractometry (XRD) and scanning electron microscopy (SEM)-energy dispersive spectrometry (EDS), and the stability of the obtained M-rich compounds was determined. Finally, the relationship between the electrode potential and type of Sm-M intermetallic compounds formed was assessed on the basis of the observed electrochemical properties and electrodeposits.