Role of Chloride Ion on Nickel Plating
Role of Chloride Ion on Nickel Plating
复制标题
氯离子对镀镍的作用
DOI：
10.4139/sfj.41.312
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发表时间：
1990
期刊：
影响因子：
--
通讯作者：
S. Haruyama
中科院分区：
文献类型：
--
作者：
M. Yasuda;I. Ohno;S. Haruyama
利用一种特殊的电解池，研究了氯离子在镀镍过程中的作用，这种电解池可以连续测量电沉积过程中放出的氢的量。研究发现，氯离子浓度的增加加速了镍的沉积，抑制了氢的共析，且氯离子的这些作用在高pH值下尤为显著。电沉积镍的动力学参数完全由假设含氯化物吸附中间体导出的动力学方程来解释。在镍电沉积过程中，反应中间体的吸附很可能减少了析氢有效位点的数量
The role of chloride ion in the plating of nickel has been studied by using a special electrolytic cell which permits continuous measurement of the amount of hydrogen evolved during electrodeposition. It was found that an increase in the concentration of chloride ion accelerated the deposition of nickel and inhibited the co-evolution of hydrogen, and these effects of chloride were especially remarkable at high pH values. The kinetic parameters for the electrodeposition of nickel were fully explained by a kinetic equation derived by assuming a chloride-containing adsorbed intermediate. It is considered highly probable that the number of effective sites for hydrogen evolution is reduced by adsorption of the reaction intermediate during the electrodeposition of nickel