Tensile properties of copper with nano-scale twins
Tensile properties of copper with nano-scale twins
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纳米级孪晶铜的拉伸性能
DOI：
10.1016/j.scriptamat.2005.01.033
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发表时间：
2005-05-01
影响因子：
6
通讯作者：
Lu, K
中科院分区：
文献类型：
--
作者：
Shen, YF;Lu, L;Lu, K
具有高密度纳米尺度生长孪晶的电沉积Cu样品显示出具有相当大的塑性应变（> 13%）的高抗拉强度（类似于1GPa）。强度和塑性均随孪晶层厚度的减小而增大。屈服强度值遵循传统多晶Cu的经验Hall-Petch关系。(c)2005 Acta Materialia Inc.由爱思唯尔有限公司出版。保留所有权利。
An electro-deposited Cu sample with a high density of nano-scale growth twins shows an ultrahigh tensile strength (similar to 1 GPa) with a considerable plastic strain (> 13%). Both the strength and the ductility increase with a decreasing twin lamellae thickness. The yield strength values follow the empirical Hall-Petch relationship for conventional polycrystalline Cu. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.