Effect of graded interlayer on the mode I edge delamination by residual stresses in multilayer coating-based systems

Effect of graded interlayer on the mode I edge delamination by residual stresses in multilayer coating-based systems
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DOI:
10.1016/j.apsusc.2007.07.108
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发表时间:
2008-01
影响因子:
6.7
通讯作者:
X. C. Zhang;Bo Xu;H. Wang;Y. X. Wu
X. C. Zhang;Bo Xu;H. Wang;Y. X. Wu
中科院分区:
材料科学1区
文献类型:
--
作者:
X. C. Zhang;Bo Xu;H. Wang;Y. X. Wu

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由于相邻层之间的材料失配,多层系统的边缘附近存在界面剥离应力,因此可以引发模式I边缘分层。然而,使用现有的解析和数值模型不能得到精确的剥离应力分布。最近有人提出,剥离力矩产生的局部剥离应力可以用来表征模式I的边缘分层。本文研究了梯度夹层对多层涂层基系统中热残余应力引起的I型边缘分层的影响。在前人分析方法的基础上,分别推导了双层系统、典型热障涂层(TBC)系统和陶瓷层与金属层之间插入梯度夹层的热障涂层系统的各界面剥离力矩和曲率的精确闭合解。案例研究表明,通过适当选择涂层材料和涂层厚度,可以阻止由热应力引起的边缘分层。这些研究可能会提供一些重要的见解,发展多层系统的故障安全设计方法。
The mode I edge delamination could be initiated due to the presence of the interfacial peeling stresses near the edges of the multilayered systems due to the material mismatches between the adjacent layers. However, the exact peeling stress distributions could not be obtained by using the existing analytical and numerical models. It was proposed recently that the peeling moment resulting from the localized peeling stresses could be used to characterize mode I edge delamination. In this paper, the effect of the graded interlayer on the mode I edge delamination by thermal residual stresses in multilayer coating-based systems was investigated. Following the previous analysis approaches, the exact closed-form solutions for the peeling moments at individual interfaces and the curvatures for bilayer system, typical thermal barrier coating (TBC) system and TBC-based system with a graded interlayer inserted between the metallic layer and the ceramic layer were, respectively, derived. Case studies showed that the edge delamination by thermal stress could be impeded by properly selecting the coating materials and individual layer thicknesses. These studies may provide some important insights for developing fail-safe designing methodologies for multilayered systems.