Smooth Thin Film of a CoNiCu Medium-Entropy Alloy Consisting of Single Nanometer-Sized Grains Formed by Electrodeposition in a Water-in-Oil Emulsion
Smooth Thin Film of a CoNiCu Medium-Entropy Alloy Consisting of Single Nanometer-Sized Grains Formed by Electrodeposition in a Water-in-Oil Emulsion
复制标题
油包水乳液中电沉积形成的由单纳米晶粒组成的 CoNiCu 中熵合金的光滑薄膜
DOI：
10.1021/acs.jpcc.2c08033
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发表时间：
2023
期刊：
影响因子：
--
通讯作者：
Fukami Kazuhiro
中科院分区：
文献类型：
--
作者：
Murakami Yuki;Murase Kuniaki;Fukami Kazuhiro
高熵和中熵合金是一类具有优异强度和韧性的新型合金。这些合金预期用作多功能催化剂，因为已经建立了生产这种合金的纳米颗粒的方法。相比之下，形成这种合金的薄膜的生产方法仍然非常有限。在这里，我们表明，电沉积在化学稳定的油包水乳液功能作为一种通用的方法来形成薄膜的这种合金。电沉积制备这类合金薄膜的关键是在限制扩散的条件下进行还原，并限制液滴中的浓度分布。这种情况在常规的本体水性或非水性单相溶液中无法实现，但在油包水乳液中可以实现。在此，我们发现气溶胶OT作为本发明油包水乳液的合适表面活性剂以在电沉积期间稳定乳液。还阐明了通过添加甘油而增加水滴内的水溶液的粘度大大降低了粗糙度。这里展示的策略，预计将刺激进一步的应用研究到薄膜的高和中熵合金。
High-entropy and medium-entropy alloys are new classes of alloys that exhibit excellent strength and toughness. These alloys are expected to be used as multifunctional catalysts given that methods for producing nanoparticles of such alloys have been established. By contrast, the production methods to form thin films of such alloys are still very limited. Here, we show that electrodeposition in a chemically stabilized water-in-oil emulsion functions as a general method to form thin films of such alloys. The key to forming thin films of these alloys by electrodeposition is to conduct reduction under diffusion-limited conditions and to confine the distribution of concentration in a droplet. This situation is not achieved in conventional bulk aqueous or nonaqueous single-phase solution but is achieved in a water-in-oil emulsion. Here, we found aerosol OT as a suitable surfactant for the present water-in-oil emulsion to stabilize the emulsion during electrodeposition. It is also clarified that the increase in viscosity of the aqueous solution within water droplets by the addition of glycerol decreases the roughness greatly. The strategy demonstrated here is expected to spur further applied research into thin films of high- and medium-entropy alloys.
影响因子：
15
作者：
Shuji Nakanishi;Kazuhiro Fukami;T. Tada;Y. Nakato
通讯作者：
Y. Nakato
影响因子：
3.7
作者：
Matthew W. Glasscott;C. Hill;J. Dick
通讯作者：
Matthew W. Glasscott;C. Hill;J. Dick
影响因子：
16.6
作者：
Xie, Pengfei;Yao, Yonggang;Wang, Chao
通讯作者：
Wang, Chao