The Multidimensional Integrated Intelligent Imaging project (MI-3)
The Multidimensional Integrated Intelligent Imaging project (MI-3)
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DOI：
10.1016/j.nima.2009.01.112
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发表时间：
2009-06-01
影响因子：
1.4
通讯作者：
Zin, H.
中科院分区：
文献类型：
--
作者：
Allinson, N.;Anaxagoras, T.;Zin, H.
MI-3是一个由11所大学和研究实验室组成的联盟，其使命是开发互补金属氧化物半导体（CMOS）有源像素传感器（APS），并将这些传感器应用于一系列成像挑战。已经开发了一系列传感器：像素上智能CMOS（OPIC）-设计用于像素内智能; FPN-设计用于开发用于减少固定模式噪声的新技术; HDR-设计用于开发用于增加动态范围的新技术; Vanilla/PEAPS-具有数字和模拟模式以及感兴趣区域，其也被回薄;大面积传感器（LAS）-新颖的缝合LAS;和eLeNA-它开发了一系列低噪声像素。正在开发的应用包括放射自显影、伽马照相机系统、放射治疗核查、组织衍射成像、X射线相衬成像、DNA测序和电子显微镜。(C)2009 Elsevier B. V.保留所有权利。
MI-3 is a consortium of 11 universities and research laboratories whose mission is to develop complementary metal-oxide semiconductor (CMOS) active pixel sensors (APS) and to apply these sensors to a range of imaging challenges. A range of sensors has been developed: On-Pixel Intelligent CMOS (OPIC)-designed for in-pixel intelligence; FPN-designed to develop novel techniques for reducing fixed pattern noise; HDR-designed to develop novel techniques for increasing dynamic range; Vanilla/PEAPS-with digital and analogue modes and regions of interest, which has also been back-thinned; Large Area Sensor (LAS)-a novel, stitched LAS; and eLeNA-which develops a range of low noise pixels. Applications being developed include autoradiography, a gamma camera system, radiotherapy verification, tissue diffraction imaging, X-ray phase-contrast imaging, DNA sequencing and electron microscopy. (C) 2009 Elsevier B.V. All rights reserved.