Ni3Sn4-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging
Ni3Sn4-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging
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DOI：
10.1016/j.matdes.2016.07.027
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发表时间：
2016-10
影响因子：
8.4
通讯作者：
H. Ji;Minggang Li;Shu-yi Ma;Mingyu Li
中科院分区：
文献类型：
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作者：
H. Ji;Minggang Li;Shu-yi Ma;Mingyu Li
瞬态液相流的耗时是芯片键合中的一大难题。本文提出了一种新的快速键合方法和合金化设计，以低成本地制备高温电子封装用SnSingle BondNi金属间化合物接头。系统地研究了超声效应以及接头组织和剪切强度随镍含量的变化规律。随着Ni含量的增加，接头中Ni3Sn4的含量增加，当Ni含量达到24wt.%时，接头由接近单一的Ni3Sn4相组成，其剪切强度达到43.4×10-6 Mpa。在300℃空气中时效72h后，由于残余锡向Ni3Sn4的相变，Ni含量较小的焊料获得的接头的剪切强度有很大提高，而对于Sn24wt.%Ni和Sn30wt.%Ni，由于Ni3Sn4的晶粒粗化，接头的剪切强度略有下降。超声辅助焊接过程中，声空化效应和流动效应显著地加速了镍和锡的反应。采用锡-24wt.%Ni焊料获得的焊点在电力电子封装中具有最大的应用潜力。
The time-consuming of transient-liquid-phase is a big challenge for the die bonding. In this paper, a novel rapid bonding method plus alloying design was proposed to cheaply fabricate Snsingle bondNi intermetallic joint for high temperature electronic packaging. The ultrasonic effect and the evolution of the joint microstructures, shear strength as a function of Ni content were systemically investigated. The amount of Ni3Sn4in the joint increased with the addition of Ni, and when the Ni content reached 24 wt.%, the joint consisted of nearly sole Ni3Sn4with a high shear strength of 43.4 MPa was achieved. After aging at 300 °C for 72 h in air, the shear strength of the joint obtained with smaller Ni content solder showed great improvement because of the phase transformation of residual Sn to Ni3Sn4, but for the Sn-24 wt.%Ni and Sn-30 wt.%Ni, it showed a little decrease due to the grains coarsening of Ni3Sn4. The acoustic cavitation and streaming effects dramatically accelerates the reaction of Ni and Sn during the ultrasonic-assisted soldering. The joint obtained by the Sn-24 wt.%Ni solder has the best potential to be applied in the power electronic packaging.