Effects of Fe on wetting behaviors and interfacial characteristics between copper alloy and W substrate
Effects of Fe on wetting behaviors and interfacial characteristics between copper alloy and W substrate
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发表时间：
2009
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通讯作者：
Xiaotong Peng
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作者：
Xiaotong Peng
采用座滴法，分别研究了真空和Ar气氛中铜-铁合金在钨表面的润湿行为，以及添加铁对铜/钨界面结合条件的影响。用扫描电子显微镜、电子探针和X射线衍射仪分析了添加Fe元素后铜/钨界面的微观组织和结合机制。结果表明，随着液态铜中Fe含量的增加，铜在W基片上的润湿角减小，润湿角也随着润湿温度的升高而减小。与真空中的实验结果相比，随着Ar气氛中Fe含量的增加，润湿角急剧减小，当Fe含量达到1.2%(质量分数)1300℃时，熔体与W的接触角从107.5°减小到47.5°。在铜/钨界面处存在厚度为1~2μm的合金化过渡层，由直界面转变为锯齿状界面。随着润湿温度的升高，Cu、Fe、W原子的相互扩散和溶解作用更加强烈，Fe原子扩散并溶解到W和Cu基体中，CuFe/W界面上没有新的反应相。通过相互扩散和溶解，铜/钨界面的结合机制由最初的机械结合转变为冶金结合。
By the sessile drop technique, the wetting behaviors of Cu-Fe alloys on W matrixes in the vacuum and Ar atmosphere, and the effect of Fe addition on the bonding conditions of Cu/W interface were studied respectively. SEM, EPMA and X-ray diffraction were used to analyze the microstructure and bonding mechanism of the Cu/W interface with the addition of Fe element. The results show that the wetting angle of Cu on W substrates decreases with increasing content of Fe in liquid Cu, and the wetting angle also decreases with increasing wetting temperature. Compared with the experimental results in the vacuum, the wetting angle decreases dramatically with increasing content of Fe in Ar atmosphere, and the contact angle between molten Cu and W substrate decreases from 107.5° to 47.5° while the content of Fe is up to 1.2% (mass fraction) at 1 300 ℃. There is an alloying transition layer with a thickness 1-2 μm at the Cu/W interface, and the straight interface of Cu/W system is turned into serrate interface. With increasing wetting temperature, the mutual diffusion and dissolution of Cu, Fe, and W atoms are much more intense, the Fe atoms are diffused and dissolved into the W and Cu matrixes, and there is no new reactive phase on the CuFe/W interface. The bonding mechanism of Cu/W interface is transformed from the initial mechanical bond into the metallurgical bond by means of mutual diffusion and dissolution.