Construction of microfluidic chips using polydimethylsiloxane for adhesive bonding
Construction of microfluidic chips using polydimethylsiloxane for adhesive bonding
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DOI：
10.1039/b510494g
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发表时间：
2005-01-01
期刊：
影响因子：
6.1
通讯作者：
Zare, RN
中科院分区：
文献类型：
--
作者：
Wu, HK;Huang, B;Zare, RN
将涂布在载玻片上的聚二甲基硅氧烷（PDMS）预聚物薄层转移到图案化基底的压花区域表面上。使该涂覆的基底与平板接触，并且通过热固化（60 ℃，30分钟）预聚物将两个结构永久结合以形成密封的流体系统。PDMS仅存在于两个表面的接触区域处，其中暴露于微流体通道的部分可忽略不计。通过结合两种代表性软材料（PDMS板上的PDMS衬底）和两种代表性硬材料（玻璃板上的玻璃衬底）的微流体通道来证明该方法。计算了玻璃通道中粘附层对电渗流的影响，并与毛细管电泳分离的实验结果进行了比较。对于尺寸为约10至500 mm的通道，类似于200 - 500 nm厚的粘合剂层产生没有空隙或过量材料的结合，并且对渗透率几乎没有影响。这种粘合方法的主要优点是它的通用性和易用性。
A thin layer of polydimethylsiloxane ( PDMS) prepolymer, which is coated on a glass slide, is transferred onto the embossed area surfaces of a patterned substrate. This coated substrate is brought into contact with a flat plate, and the two structures are permanently bonded to form a sealed fluidic system by thermocuring ( 60 degrees C for 30 min) the prepolymer. The PDMS exists only at the contact area of the two surfaces with a negligible portion exposed to the microfluidic channel. This method is demonstrated by bonding microfluidic channels of two representative soft materials ( PDMS substrate on a PDMS plate), and two representative hard materials ( glass substrate on a glass plate). The effects of the adhesive layer on the electroosmotic flow (EOF) in glass channels are calculated and compared with the experimental results of a CE separation. For a channel with a size of approximately 10 to 500 mm, a similar to 200 - 500 nm thick adhesive layer creates a bond without voids or excess material and has little effect on the EOF rate. The major advantages of this bonding method are its generality and its ease of use.