DFX of a 3rd Generation, 16-core/32-thread UltraSPARC- CMT Microprocessor
DFX of a 3rd Generation, 16-core/32-thread UltraSPARC- CMT Microprocessor
复制标题
第三代 16 核/32 线程 UltraSPARC-CMT 微处理器的 DFX
DOI：
10.1109/test.2008.4700552
复制
发表时间：
2008
期刊：
影响因子：
--
通讯作者：
R. Pendurkar
中科院分区：
文献类型：
--
作者：
I. Parulkar;S. Anandakumar;G. Agarwal;Gordon Liu;K. Rajan;F. Chiu;R. Pendurkar
Sun Microsystems的第三代CMT（芯片多线程）具有16个核心，可用于高吞吐量，而不会损害高单线性能。本文描述了该复杂CMT处理器和部署的DFX解决方案所面临的独特挑战。一些值得注意的新DFX功能包括高度可配置的扫描架构，一个利用功能访问路径的内存测试网络，特殊记忆的贝斯特以及在存在非确定性Serdes接口的情况下运行功能测试的测试模式。在制造业的产量和现场的可用性中，支持具有部分良好核心和缓存的芯片的鉴定。
The third generation CMT (chip multithreaded) microprocessor from Sun Microsystems has 16 cores and is optimized for high throughput without compromising high single thread performance. This paper describes the unique challenges faced in DFX of this complex CMT processor and the DFX solutions deployed. Some of the notable new DFX features include a highly configurable scan architecture, a memory test network that leverages functional access paths, BIST of special memories, and a test mode for running functional tests in the presence of non-deterministic serdes interfaces. Identification of chips with partially good cores and caches is supported in manufacturing for yield and in the field for availability.