Increasing Throughput in Fused Deposition Modeling by Modulating Bed Temperature

Increasing Throughput in Fused Deposition Modeling by Modulating Bed Temperature
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通过调节床温提高熔融沉积建模的吞吐量

DOI:
10.1115/1.4050177
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发表时间:
2021
期刊:
Journal of Manufacturing Science and Engineering
影响因子:
--
通讯作者:
Brown, Keith A.
Brown, Keith A.
中科院分区:
--
文献类型:
--
作者:
Snapp, Kelsey L.;Gongora, Aldair E.;Brown, Keith A.

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增材制造 (AM) 技术,例如熔融沉积建模 (FDM),能够通过将材料以逐层方式顺序沉积到打印床上,从三维 (3D) 数字模型制造物理组件。在 FDM 和许多其他 AM 技术中,部件在打印过程中粘附到床上至关重要。然而,打印后,过多的床粘附力可能会导致部件损坏或妨碍自动部件移除。在这项工作中,我们验证了一种新颖的测试方法,该方法可以快速、廉价地评估床粘附力,而不受零件几何形状的限制。使用这种方法,我们研究了床温对在裸硼硅酸盐玻璃和聚酰亚胺 (PI) 涂层床上打印的聚乳酸 (PLA) 部件的峰值去除力的影响。除了验证床层粘附力在 60 至 70 °C(140 至 158 °F)之间达到最大这一传统观点外,我们还观察到,将床层冷却至 40 °C (104 °F) 以下(通常为方便零件拆卸而采取的做法)的额外好处微乎其微。与直觉相反,我们发现打印后加热床通常是一种更有效的过程,可以轻松去除零件。除了引入通过床温调节来测量和优化床粘附力的通用方法之外,这些结果还可用于加速打印机农场和自主研究系统中增材制造组件的生产和测试。
Additive manufacturing (AM) techniques, such as fused deposition modeling (FDM), are able to fabricate physical components from three-dimensional (3D) digital models through the sequential deposition of material onto a print bed in a layer-by-layer fashion. In FDM and many other AM techniques, it is critical that the part adheres to the bed during printing. After printing, however, excessive bed adhesion can lead to part damage or prevent automated part removal. In this work, we validate a novel testing method that quickly and cheaply evaluates bed adhesion without constraints on part geometry. Using this method, we study the effect of bed temperature on the peak removal force for polylactic acid (PLA) parts printed on bare borosilicate glass and polyimide (PI)-coated beds. In addition to validating conventional wisdom that bed adhesion is maximized between 60 and 70 °C (140 and 158 °F), we observe that cooling the bed below 40 °C (104 °F), as is commonly done to facilitate part removal, has minimal additional benefit. Counterintuitively, we find that heating the bed after printing is often a more efficient process for facile part removal. In addition to introducing a general method for measuring and optimizing bed adhesion via bed temperature modulation, these results can be used to accelerate the production and testing of AM components in printer farms and autonomous research systems.
DOI: 10.1016/j.isci.2021.102262
发表时间: 2021-04-23
期刊: iScience
影响因子: 5.8
作者:
Gongora AE;Snapp KL;Whiting E;Riley P;Reyes KG;Morgan EF;Brown KA
通讯作者: Brown KA
DOI: --
发表时间: 2018
期刊: 3D Printing and Additive Manufacturing Technologies
影响因子: --
作者:
R. Devicharan;Raghav Garg
通讯作者: Raghav Garg
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DOI: --
发表时间: 2017
期刊: Conference on Industrial Electronics and Applications
影响因子: --
作者:
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通讯作者: Jaroslav Petrus
DOI: 10.1108/rpj-09-2016-0150
发表时间: 2018-01-01
影响因子: 3.9
作者:
Marasso, Simone Luigi;Cocuzza, Matteo;Pirri, Candido Fabrizio
通讯作者: Pirri, Candido Fabrizio
DOI: 10.1115/1.4041747
发表时间: 2019-02-01
影响因子: 4
作者:
Lee, Dongoh;Lee, Younghun;Kim, Namsu
通讯作者: Kim, Namsu