Short-Circuit Transmission Line Method for PIM Evaluation of Metallic Materials
Short-Circuit Transmission Line Method for PIM Evaluation of Metallic Materials
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DOI：
10.1109/apmc.2006.4429682
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发表时间：
2006-12
影响因子：
2.1
通讯作者：
Y. Yamamoto;N. Kuga
中科院分区：
文献类型：
--
作者：
Y. Yamamoto;N. Kuga
本文提出了一种用于金属材料无源互调评价的短路传输线方法。该方法是一种基于电流的PIM评价方法，对金属材料和电触点的表征是有效的。被测器件不需要阻抗匹配条件。因此，它的形状可以任意选择。该方法实现了金属材料的定量表征，并证明了用施加电流密度表征材料是有效的，为材料的选择提供了公平的评估。利用该方法，可以对任意宽度和厚度的铜箔进行性能评价，而不影响其特性阻抗。该方法适用于SMA连接器等实际微波器件。结果表明，该方法得到的PIM电平比传统的阻抗匹配线法提高了18 dB。结果表明，本文提出的方法与匹配线法的解释是清晰的。
In this paper, a short-circuit transmission line method is proposed for passive intermodulation (PIM) evaluation of metallic materials. The method is introduced as a current-based PIM evaluation method that is effective for characterization of metallic materials and electrical contacts. The impedance matching condition is not required for a device under test. Therefore, its shape can be advantageously chosen arbitrarily. The proposed method realizes quantitative characterization of metallic materials, and demonstrates that characterizing the materials in terms of applied current density is effective to provide a fair assessment for material choice. Using the proposed method, copper foils with arbitrary width and thickness were evaluated without any effects on characteristic impedance. The proposed method is applicable to actual microwave components such as SMA connectors. The paper presents that the PIM level obtained using the proposed method is 18 dB higher than that in the conventional impedance-matched line method. As a result, a clear interpretation from the proposed method to the matched line method is also presented.