Enhanced thermal conductivity of polymer composites filled with hybrid filler
Enhanced thermal conductivity of polymer composites filled with hybrid filler
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DOI：
10.1016/j.compositesa.2005.07.006
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发表时间：
2006-01-01
影响因子：
8.7
通讯作者：
Yoon, HG
中科院分区：
文献类型：
--
作者：
Lee, GW;Park, M;Yoon, HG
本研究旨在研究以聚合物为基质的微电子封装材料。下一代封装材料除了具有低的热膨胀系数(CTE)外，还将具有高散热能力，因为高性能电子设备的累积热量应该被清除，以便正常运行。本研究采用不同形状和尺寸的氮化铝(AIN)、硅灰石、碳化硅晶须(SIC)和氮化硼(BN)等无机填料单独或联合使用制备聚合物导热复合材料。对于AIN，采用钛酸酯偶联剂对填料进行表面处理。混杂填料的使用有效地提高了复合材料的导热系数，这可能是由于混杂填料中具有大长径比的结构填料提供了更好的连通性。对于给定的填料含量，使用较大的颗粒和表面处理的填料可以得到导热系数较高的复合材料。填料的表面处理也使复合材料具有较低的热膨胀系数。(C)2005爱思唯尔有限公司。保留所有权利。
This study aims at investigating package materials based on polymer matrix for microelectronics. The next generation package materials are expected to possess high heat dissipation capability in addition to low coefficient of thermal expansion (CTE) as the accumulated heat from high performance electronic devices should be removed for proper operation. In this study, various inorganic fillers including aluminum nitride (AIN), wollastonite, silicon carbide whisker (SiC) and boron nitride (BN) with different shape and size were used alone or in combination to prepare thermally conductive polymer composites. In case of AIN, titanate Coupling agent was used for the surface treatment of fillers. The use of hybrid filler was found to be effective in increasing thermal conductivity of the composite probably due to the enhanced connectivity offered by structuring filler with high aspect ratio in hybrid filler. For given filler loading, the use of larger particle and surface treated filler resulted in composite materials with enhanced thermal conductivity. The surface treatment of filler also allowed producing the composites with lower CTE. (c) 2005 Elsevier Ltd. All rights reserved.