Effect of carbon fiber surface treatment on Cu electrodeposition: The electrochemical behavior and the morphology of Cu deposits
Effect of carbon fiber surface treatment on Cu electrodeposition: The electrochemical behavior and the morphology of Cu deposits
复制标题
碳纤维表面处理对铜电沉积的影响:电化学行为和铜沉积物的形貌
DOI:
10.1016/j.jallcom.2010.12.170
复制
发表时间:
2011-02-24
影响因子:
6.2
通讯作者:
Hu, Wenbin
中科院分区:
文献类型:
--
作者:
Li, Weiwei;Liu, Lei;Hu, Wenbin
The relationship between surface functional groups and electrochemical behaviors of polyacrylonitrile (PAN)-based carbon fibers (CFs) differentiated by oxidation treatment in air was studied. The chemical character of the CFs surface was estimated by X-ray photoelectron spectroscopy (XPS) and the electrochemical behavior of treated CFs in CuSO4 plating solution was studied by electrochemical setup. The influence of functional groups on the morphology of copper deposits was characterized by field-emission scanning electron microscopy (FESEM). It was found that the O/C atomic ratio rose rapidly from 23.05% (as-received carbon fibers) to 42.83% as the oxidation temperature was increased to 400 degrees C and the content of -C=O was the highest. Concentrations and types of the functional groups on CFs surface showed a close connection with the electrochemical response of CFs in CuSO4 plating bath. It was showed that Cu electrodeposition was the interaction of applied voltage and the reduction of surface functional groups. With the functional groups increased, the quantities of the Cu nuclei increased, further the morphology of deposited Cu was affected. (c) 2010 Elsevier B.V. All rights reserved.