CO2 laser cutting and ablative etching for the fabrication of paper-based devices
CO2 laser cutting and ablative etching for the fabrication of paper-based devices
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DOI：
10.1088/0960-1317/23/6/067003
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发表时间：
2013-06-01
影响因子：
2.3
通讯作者：
Fu, E.
中科院分区：
文献类型：
--
作者：
Spicar-Mihalic, P.;Toley, B.;Fu, E.
我们描述了一种使用市售CO2激光系统制造纸基微流体装置的方法。该方法是通用的，并且允许硝化纤维素基底的受控贯穿切割和烧蚀蚀刻。此外，激光系统可以切割各种可用于制造纸基设备的组件，包括用于设备外壳的纤维素芯吸垫、玻璃纤维源垫和聚酯薄膜基基板。
We describe a method for fabricating paper-based microfluidic devices using a commercially available CO2 laser system. The method is versatile and allows for controlled through-cutting and ablative etching of nitrocellulose substrates. In addition, the laser system can cut a variety of components that are useful in the fabrication of paper-based devices, including cellulose wicking pads, glass fiber source pads and Mylar-based substrates for the device housing.