3-Axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding
3-Axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding
复制标题
采用 CMOS 倒装接合的 3 轴完全集成表面贴装差分电容式触觉传感器
DOI：
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
Shuji Tanaka
中科院分区：
文献类型：
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作者：
S. Asano;M. Muroyama;T. Bartley;T. Nakayama;U. Yamaguchi;Hitoshi Yamada;Y. Hata;Y. Nonomura;Shuji Tanaka
本文报道了一种表面贴装在柔性总线上的三轴MEMS-CMOS集成触觉传感器。这款3轴传感器采用全新CMOS LSI，具有电容检测电路和其他扩展功能（例如可配置性和强大的时钟数据恢复算法）。该传感器是由一个倒装键合的CMOS基板与敏感膜片和一个特殊的低温共烧陶瓷（LTCC）基板与通孔。这些基板通过Au-Au键合进行电气和机械连接，形成密封的差分电容间隙。完成的传感器输出编码的三轴数字信号，根据所施加的三轴力具有小的交叉灵敏度和滞后。
This paper reports a 3-axis MEMS-CMOS integrated tactile sensor for surface-mounting on a flexible bus line. This 3-axis sensor uses a bran-new CMOS LSI with capacitive sensing circuit and other extended functionalities (e.g. configurability and a robust clock data recovery algorithm). The sensor is composed of a flip-bonded CMOS substrate with a sensing diaphragm and a special low temperature co-fired ceramics (LTCC) substrate with vias. These substrates are electrically and mechanically connected by Au-Au bonding, forming sealed differential capacitive gaps. The completed sensor outputs coded 3-axis digital signals according to applied 3-axis force with small cross-sensitivity and hysteresis.