Efficient reduction of susceptance-based package models using PRIMA

Efficient reduction of susceptance-based package models using PRIMA
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使用 PRIMA 有效简化基于电纳的封装模型

DOI:
10.1109/epep.2002.1057877
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发表时间:
2002
期刊:
Electrical Performance of Electronic Packaging,
影响因子:
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通讯作者:
L. Pileggi
L. Pileggi
中科院分区:
--
文献类型:
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作者:
M. Çelik;Hui Zheng;L. Pileggi

文献摘要

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提出了一种改进的PRIMA算法,用于大型线性互连电路的鲁棒高效降阶建模,其中包含稀疏电纳(电感矩阵逆)矩阵以捕获磁耦合。
A modified PRIMA algorithm is proposed for robust and efficient reduced order modeling of large linear interconnect circuits that include sparse susceptance (inverse of the inductance matrix) matrices to capture the magnetic couplings.