An electrohydrodynamic polarization micropump for electronic cooling
An electrohydrodynamic polarization micropump for electronic cooling
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DOI：
10.1109/84.911097
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发表时间：
2001-03-01
影响因子：
2.7
通讯作者：
DeVoe, D
中科院分区：
文献类型：
--
作者：
Darabi, J;Ohadi, MM;DeVoe, D
本文介绍了一种创新的微冷却装置的设计、制造和特性，以及在微电子领域的应用。该装置将主动蒸发冷却表面、偏振微泵和温度传感器集成到一个芯片中。微泵提供所需的泵送动作，将工质带到蒸发表面，允许通过薄膜蒸发/沸腾过程获得有效的换热系数。该设备基于VLSI微制造技术，允许电流体(EHD)电极直接集成到冷却表面上。由于EHD电极是使用与电子系统本身相同的工艺制造的，因此所提出的集成微芯片形式的微电子冷却系统非常适合大规模生产。样机的最大制冷量为65W/cm2，相应的泵浦扬程为250Pa.这项研究的结果将有助于未来能够在高功率水平下运行的微冷却设备的开发。
This paper presents the design, fabrication, and characterization of an innovative microcooling de,ice far microelectronics applications. The device incorporates an active evaporative cooling surface, a polarization micropump, and temperature sensors into a single chip. The micropump provides the required pumping action to bring the working fluid to the evaporating surface, allowing the effective heat transfer coefficient through a thin-film evaporation/boiling process. The device is based on VLSI microfabrication technology, allowing the electrohydrodynamic (EHD) electrodes to be integrated directly onto the cooling surface. Since the EHD electrodes are fabricated using the same technology as the electronic systems themselves, the proposed microelectronic cooling system in the form of an integrated microchip is very suitable for mass production. The prototype devices demonstrated a maximum cooling capacity of 65 W/cm2 with a corresponding pumping head of 250 Pa. The results of this investigation will assist in the development of future microcooling devices capable of operating at high power levels.