New Opportunities in Metallization Integration in Cofired Electroceramic Multilayers by the Cold Sintering Process
New Opportunities in Metallization Integration in Cofired Electroceramic Multilayers by the Cold Sintering Process
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DOI：
10.1021/acsaelm.9b00184
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发表时间：
2019-06
影响因子：
4.7
通讯作者：
Thomas Herrison de Beauvoir;S. Dursun;Lisheng Gao;C. Randall
中科院分区：
文献类型：
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作者：
Thomas Herrison de Beauvoir;S. Dursun;Lisheng Gao;C. Randall
高电导率金属化对于高性能多层电陶瓷器件的设计至关重要。冷烧结为不同材料类别的整合提供了令人兴奋的新机会；在这里，我们探索新颖的金属化学并展示它们与陶瓷多层的集成。由于陶瓷和金属粉末在极低的烧结温度下快速共烧结，因此能够进行加工。金属粉末被印刷成浆料并形成多层，可以与陶瓷 ZnO 共烧结；这些特定金属包括铜、铁和铝。多层结构是在厚膜工艺下组装和制造的，并通过使用聚碳酸亚丙酯粘合剂系统来实现，该粘合剂系统可以在 N2-H2 形成气体下在低温下去除，从而可以控制 Cu、Fe 和 Al 的氧化。因此，可以制造出极高电导率的电极，并通过等效串联电阻 (ESR) 进行量化。在另外...
Metallization with high conductivities is critical in the design of high performance multilayer electroceramic devices. Cold sintering offers exciting new opportunities in the integration of different material classes; here we explore novel metal chemistries and demonstrate their integration into ceramic multilayers. The processing is enabled due to the cosintering of both the ceramic and metal powders in fast times and at extremely low sintering temperatures. Metal powders are printed as pastes and formed into multilayers that can be cosintered with the ceramic ZnO; these specific metals include Cu, Fe, and Al. The multilayer structures are assembled and fabricated under a thick film process and enabled by using a polypropylene carbonate binder system that can be removed at low temperatures under N2–H2 forming gas, permitting control of oxidation of the Cu, Fe, and Al. As a result, extremely high conductivity electrodes are fabricated and quantified through the equivalent series resistance (ESR). In addi...