The application of temperature-sensitive paints for surface and fluid temperature measurements in both thermal developing and fully developed regions of a microchannel
The application of temperature-sensitive paints for surface and fluid temperature measurements in both thermal developing and fully developed regions of a microchannel
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温敏涂料在微通道热显影和完全显影区域的表面和流体温度测量中的应用
DOI：
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发表时间：
2013
期刊：
影响因子：
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通讯作者：
T. Liou
中科院分区：
文献类型：
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作者：
Chih;Chengjun Li;Hsiang;T. Liou
本文采用温敏涂料（TSP）技术对横截面宽深比为8.47的聚二甲基硅氧烷直微通道内的传热进行了实验分析。TSP技术能够在恒定壁温条件下通过微通道获得表面和流体的温度分布，每像素的详细分辨率为144 µm。对采集的温度数据进行了分析，研究了热发展区和充分发展区的传热和努塞尔数。由实验结果估算的热入口长度与平行板系统的经验公式吻合较好，但充分发展区的努塞尔数有所偏离。这种偏差是由于沟道尺度小，放大了双电层和表面边界条件的影响。这些结果表明，TSP技术在为微型设备内部的传热研究提供详细且有价值的信息方面具有巨大潜力。
This work presents the experimental analysis of heat transfer in a straight polydimethylsiloxane microchannel with cross-sectional width/depth ratio of 8.47 using the temperature-sensitive paint (TSP) technique. The TSP technique is capable of acquiring temperature profiles for both the surface and the fluid with a detailed resolution of 144 µm per pixel through the microchannel under the constant wall temperature condition. The acquired temperature data have been analyzed to study the heat transfer and Nusselt numbers in both thermal developing and fully developed regions. The estimation of thermal entrance length from the experimental results shows good agreement with the empirical equation of the parallel-plate system, while the Nusselt numbers in the fully developed region deviate. This deviation is attributed to the small scale of the channel, which amplifies the effects of the electric double layer and the surface boundary condition. These results demonstrate the great potential of the TSP technique in providing detailed and valuable information for heat transfer investigation inside microdevices.