A Si/Glass Bulk-Micromachined Cryogenic Heat Exchanger for High Heat Loads: Fabrication, Test, and Application Results.

A Si/Glass Bulk-Micromachined Cryogenic Heat Exchanger for High Heat Loads: Fabrication, Test, and Application Results.
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DOI:
10.1109/jmems.2009.2034322
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发表时间:
2010-02
期刊:
Journal of microelectromechanical systems : a joint IEEE and ASME publication on microstructures, microactuators, microsensors, and microsystems
影响因子:
--
通讯作者:
Gianchandani YB
Gianchandani YB
中科院分区:
其他
文献类型:
--
作者:
Zhu W;White MJ;Nellis GF;Klein SA;Gianchandani YB

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本文报道了一种带有原位温度传感器的微机械硅/玻璃堆回热式换热器。许多高导电性硅板与集成铂电阻温度探测器(Pt rtd)堆叠在一起,与低导电性的耐热玻璃间隔片交替使用。该设备的占地面积为1 × 1-cm2,长度可达3.5厘米。它用于焦耳-汤姆逊(J-T)冷却器,可以承受超过1mpa的压力。冷端进口温度为237 K ~ 252 K时,当氦气质量流量为0.039 g/s时,换热器效率为0.9。在205 K - 296 K的工作范围内,集成Pt rtd的线性响应为0.26%-0.30% /K,但在较低的温度下仍然可用。在以乙烷为工质的自冷试验中,有热交换器的J-T系统在压力为835.8 kPa时,比进口温度下降76.1 K,达到218.7 K。系统暂态达到200k;进一步的冷却受到流体中冻结的杂质的限制。在带有外部热负荷的J-T自冷试验中,系统在提供1w冷却的同时达到了239 K。在所有情况下,有一个额外的寄生热负荷估计在300 - 500mw。
This paper reports on a micromachined Si/glass stack recuperative heat exchanger with in situ temperature sensors. Numerous high-conductivity silicon plates with integrated platinum resistance temperature detectors (Pt RTDs) are stacked, alternating with low-conductivity Pyrex spacers. The device has a 1 × 1-cm2 footprint and a length of up to 3.5 cm. It is intended for use in Joule–Thomson (J–T) coolers and can sustain pressure exceeding 1 MPa. Tests at cold-end inlet temperatures of 237 K–252 K show that the heat exchanger effectiveness is 0.9 with 0.039-g/s helium mass flow rate. The integrated Pt RTDs present a linear response of 0.26%–0.30%/K over an operational range of 205 K–296 K but remain usable at lower temperatures. In self-cooling tests with ethane as the working fluid, a J–T system with the heat exchanger drops 76.1 K below the inlet temperature, achieving 218.7 K for a pressure of 835.8 kPa. The system reaches 200 K in transient state; further cooling is limited by impurities that freeze within the flow stream. In J–T self-cooling tests with an external heat load, the system reaches 239 K while providing 1 W of cooling. In all cases, there is an additional parasitic heat load estimated at 300–500 mW.