High thermal conductive diamond/Cu-Ti composites fabricated by pressureless sintering technique
High thermal conductive diamond/Cu-Ti composites fabricated by pressureless sintering technique
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DOI：
10.1016/j.applthermaleng.2013.11.065
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发表时间：
2014-08-01
影响因子：
6.4
通讯作者：
Lin, Su-Jien
中科院分区：
文献类型：
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作者：
Chung, Chih-Yu;Lee, Mu-Tse;Lin, Su-Jien
传统的粉末冶金法制备的金刚石/铜复合材料由于金刚石与铜基体之间的润湿性差而导致热导率较低。本研究所采用的制备方法为制备金刚石/金属复合材料提供了一种简单、低成本的方法。研究了在1373 K下无压烧结30 min制备的金刚石/Cu-Ti复合材料随金刚石粒度和体积分数变化的热性能。在这项研究中生产的复合材料表现出高达608 W/m K的热导率为60体积%。双峰金刚石/Cu-2at.% Ti复合材料，包含50体积%尺寸为300 μ m和10体积%的金刚石颗粒金刚石颗粒尺寸为150 μ m。得到了合适的热膨胀系数为5.4 × 10（-6）1/K。该热导率值达到Hasselman和约翰逊模型结合扩散失配模型计算热导率值的92%。模型预测值与实验值吻合较好。此外，无压烧结是一种简单的技术，只需要低成本的设备，使这种具有成本效益的方法有吸引力的金属基复合材料的制造。(C)2013作者由爱思唯尔有限公司出版。保留所有权利。
Diamond/Cu composites fabricated via the traditional powder metallurgy method show low thermal conductivities due to the poor wettability between diamond and Cu matrix. The fabrication method adopted in this study provides a simple and low-cost method for producing diamond/metal composites. Thermal properties of the diamond/Cu-Ti composites fabricated by pressureless sintering at 1373 K for 30 min with variation in diamond particle sizes and volume fractions were thoroughly investigated. The composites produced in this study exhibited thermal conductivity as high as 608 W/m K for 60 vol.% bimodal diamond/Cu-2 at.% Ti composite comprised of 50 vol.% diamond particles with the size of 300 mu m and 10 vol.% diamond particles with the size of 150 mu m. A suitable coefficient of thermal expansion of 5.4 x 10(-6) 1/K was obtained. This thermal conductivity value comes up to 92% of the thermal conductivity calculated by Hasselman and Johnson model combining with diffuse mismatch model. The predicted value from this model is in good agreement with the experimental value. Furthermore, the pressureless sintering is a simple technique that requires only low-cost equipment, making this cost-effective method attractive for metal matrix composite fabrication. (C) 2013 The Authors. Published by Elsevier Ltd. All rights reserved.