Dynamic Process Behavior in Laser Chemical Micro Machining of Metals
Dynamic Process Behavior in Laser Chemical Micro Machining of Metals
复制标题
金属激光化学微加工中的动态过程行为
DOI：
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发表时间：
2018
影响因子：
3.2
通讯作者：
H. Messaoudi
中科院分区：
文献类型：
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作者：
S. Mehrafsun;H. Messaoudi
激光化学加工 (LCM) 是一种非常规加工方法，可实现金属表面光滑、精确的微观结构。然而，高质量去除仅限于约 100 mW 的激光功率窗口。这是由于对去除干扰（例如金属盐和氧化物的沉积）高度敏感。在这项工作中，研究了不同磷酸溶液中钛 (3.7024) 和不锈钢 (AISI 304) 激光化学加工从无干扰到干扰去除过渡的动态过程行为。因此，使用共焦扫描显微镜记录去除腔，并根据激光功率、进给速度和电解质浓度对宽度、深度和质量进行表征。虽然发现无扰动范围内的去除特性与材料无关，但受扰动范围强烈依赖于材料对气泡粘附的趋势。相互作用区域的附加 CCD 记录表明，向受干扰状态的过渡伴随着显着的光反射，从而表明粘附气泡对干扰去除过程的影响。此外，还介绍了典型的去除干扰，并讨论了其发生的机制。
Laser chemical machining (LCM) is a non-conventional processing method that enables a smooth and precise micro structuring of metallic surfaces. However, a high-quality removal is limited to a laser power window of some 100 mW. This is due to the high sensibility to removal disturbances, such as the deposition of metallic salts and oxides. In this work, the dynamic process behavior around the transition from a disturbance-free to a disturbed removal is investigated for the laser chemical machining of titanium (3.7024) and stainless steel (AISI 304) in different phosphoric acid solutions. Therefore, the removal cavities are recorded using confocal scanning microscopy and characterized regarding width, depth and quality in dependence of the laser power, feed velocity and electrolyte concentration. While the removal characteristics within the disturbance-free regime are found to be material-independent, the disturbed regime is strongly dependent on the tendency of the material to gas bubble adherence. Additional CCD records of the interaction zone reveal that the transition to the disturbed regime is accompanied by significant light reflections and thereby indicate the influence of adhering gas bubbles on disturbing the removal process. Moreover, typical removal disturbances are presented and discussed with regard to the responsible mechanisms for their occurrence.
激光化学加工的热分析：第一部分：静态辐射
DOI：
10.4236/msa.2017.810049
发表时间：
2017
期刊：
Materials Sciences and Applications
影响因子：
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作者：
Messaoudi;Eckert;Vollertsen
通讯作者：
Vollertsen