Structure and carrier transport properties of hot‐press deformed Bi0.5Sb1.5Te3

Structure and carrier transport properties of hot‐press deformed Bi0.5Sb1.5Te3
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热压变形Bi0.5Sb1.5Te3的结构和载流子传输性能

DOI:
10.1002/pssa.200925133
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发表时间:
2010
期刊:
影响因子:
--
通讯作者:
E. Tanabe
E. Tanabe
中科院分区:
--
文献类型:
--
作者:
H. Kitagawa;A. Kurata;H. Araki;S. Morito;E. Tanabe

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对Bi0.5Sb1.5Te3进行了热压变形研究,以获得具有优选织构取向的多晶,用于热电应用。采用机械合金化(MA)和热压(HP)法制备源材料,并在石墨模具中施加机械压力,在673 ~ 823 K下进行变形。材料被挤压的方向与施加压力的方向相反。X射线衍射(XRD)和电子背散射衍射(EBSD)分析表明,在高温下变形的样品的六边形c -面较好地沿挤压方向排列。霍尔迁移率随变形温度的升高而增大,且与织构取向有良好的相关性。
A hot‐press deformation study of Bi0.5Sb1.5Te3 was undertaken to obtain polycrystals with a preferred textural orientation for use in thermoelectric applications. Source materials were prepared by mechanical alloying (MA) as well as hot pressing (HP) and they were deformed at 673–823 K by applying mechanical pressure in a graphite die. The materials were extruded in a direction opposite to the direction of the applied pressure. X‐ray diffraction (XRD) and electron backscattered diffraction (EBSD) analyses indicated that the hexagonal c‐planes of the samples that were deformed at high temperatures preferably aligned along the direction of the extrusion. The Hall mobility increased as the deformation temperature increased and it showed a good correlation to the textural orientation.
DOI: 10.1016/j.jallcom.2003.11.141
发表时间: 2004-07-28
影响因子: 6.2
作者:
Kim, SS;Yamamoto, S;Aizawa, T
通讯作者: Aizawa, T