A flexible 300 mm integrated Si MOS platform for electron- and hole-spin qubits exploration

A flexible 300 mm integrated Si MOS platform for electron- and hole-spin qubits exploration
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用于电子和空穴自旋量子位探索的灵活 300 mm 集成 Si MOS 平台

DOI:
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发表时间:
2020
期刊:
International Electron Devices Meeting
影响因子:
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通讯作者:
I. Radu
I. Radu
中科院分区:
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文献类型:
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作者:
R. Li;N. D. Stuyck;S. Kubicek;J. Jussot;B. Chan;F. Mohiyaddin;A. Elsayed;M. Shehata;G. Simion;C. Godfrin;Y. Canvel;T. Ivanov;L. Goux;B. Govoreanu;I. Radu

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我们报告了一种灵活的300毫米工艺,该工艺最佳地结合了光学和电子束光刻来制造硅自旋量子比特。它支持动态布局设计修改,同时允许器件采用n型或p型欧姆植入,间距小于100 nm,均匀临界尺寸低至30 nm,标准偏差约1.6 nm。各种n型和p型量子比特在温度~ 10 mK的稀释冰箱中被表征。电测量显示了定义良好的量子点,可调谐的隧道耦合和相干自旋控制,这是实现大规模量子处理器的基本要求。
We report on a flexible 300 mm process that optimally combines optical and electron beam lithography to fabricate silicon spin qubits. It enables on-the-fly layout design modifications while allowing devices with either n- or p-type ohmic implants, a pitch smaller than 100 nm, and uniform critical dimensions down to 30 nm with a standard deviation ~ 1.6 nm. Various n- and p-type qubits are characterized in a dilution refrigerator at temperatures ~ 10 mK. Electrical measurements demonstrate well-defined quantum dots, tunable tunnel couplings, and coherent spin control, which are essential requirements for the implementation of a large-scale quantum processor.